TSE Co., Ltd.

Cheonan-si, Chungnam, 
Korea (South)
  • Booth: K3076
  • - 1st Floor


 Products

  • Probe Card(HPC)
    HPC (High Performance Probe Card)...

    • High parallelism up to 2,500para
    • Pin count up to 50,000pins
    • 1st Article 8 weeks delivery
    • Repeat 6weeks delivery
    • Pad size : 50x55um
    • PAD pitch : > 66um
    ITEM Specification
    1 Supp. Temp

     -30 ℃ ~ 125 ℃

    2 PH Area 12” with Ø480 mm(Main-PCB Size)
    3 Pad Size 55 ㎛ x 60 ㎛
    4 Pad to Pad Min Pitch 64 ㎛
    5 Probing Area 12 inch
    6 Probe Force 1 pin criteria 0.9 gf/mil
    7

    Needle Type & Tip Shape*

    Material Rhodium & MEMS tip shape Rectangle
    8 Probe Thickness Probe Thickness 36 ㎛
    9 Alignment key algorithmic Have ( UF3000 No. 102)
    10

    Tip diameter spec

    11 ㎛ x 14 ㎛ (±3 ㎛)
    11 Tip Length spec 45 ㎛ (Available Tip length : 25um)
    12 Planarity spec ≤ 30 ㎛
    13 Tip Position

    ≤+- 8um

    14 Leakage Current ≤ 50 nA at 10 V
    15 Current Capacity Max. 700 mA @90℃
    16 Contact Resistance spec. ≤10 Ω
    17 Recommend PRD. OD(First touch) OD 3 mil ~ 4 mil(75 ㎛ ~ 100 ㎛) / Max. 5 mil(125 ㎛)
    18 Recommend Clean OD(First touch) OD 3 mil ~ 4 mil(75 ㎛ ~ 100 ㎛)
    19 Probe Depth 12 mm ±0.3 mm(Main PCB Bottom Standard)
    20 Recommend Clean Material N/P Sheet: GC6000-75 PET Type, GC8000-75 PET Type
    21 Recommend Count per clean GC8000 ≤ 3 TD, GC6000 ≤ 5 TD
    22 Recommend Interval of clean N/P period : 25 wafers or customized

  • Load Board
    Load board is an interface board to test SOC package such as CPU, Chipset, GPU and AP. TSE is providing high speed, high performance load board to the major semiconductor customers like Intel, Samsung and AMD in worldwide....

  • > V93K 769BGA Dual Site Final Test Load Board (Picture)

    > ATE design library - V93K, T2000, Ultraflex, J750 and many more testers.

    > Accumulated PCB design know-how for 25 years and SI/PI simulation capability

    > TSE has owned PCB Fab and ass'y and test line in house.

    > TSE provides load board including stiffener frame and test socket as a turnkey solution.

  • 65um pitch TF MLO
    Fine pitch solution - C4 65um Pad (Bump) pitch. Mems Technology Thin film Stack up Process. Short delivery and Turn Key solutions for Vertical Probe card....

  • > C4 Pad Pitch : 65um

    > Thickness : 1T // 1.5T // 2.5T

    > Layer : Thinfilm 3 layer + MLO 6 layers

    > Mems Technology Thin film Stackup process

    > Short delivery than conventional MLO

    > TurnKey Solution (Design +PCB FAB+MLO FAB+Probe Card assembly)

  • Extreme Temperture TIB (Test Interface Board)
    Extreme Temperature TIB(Test Interface Board). TSE Interface board specialized in Extreme Temperature Package Test....

  • Extreme Temperature Test has been required in the Memory Test Envoironment.

    TSE has developed our own specialized Interface Board System for Extreme Temperature Pacakge Test.

    Extreme Temperature TIB(Test Interface Board)

    -. Extreme temperature Connector developed

    -. Docking Epoxy Frame Material developed

    -. Direct Cooling Interface Board developed

    > Coolant, Direct Active IC Cooling

    > Component Antioxidants

    > Temp. Reduced stabilization time

  • V93K Direct Docking Mems Probe card
    Improve CCC than conventional Cobra Probe! Good reliability probing planarity as Mems technology. Various Direct docking wafer probing solutions!...

  • > Probe : MEMS Cobra Pin (60x60um Cobra type)

    > Contact force : 1.2gF/mil

    > CCC : 950mA

    > Square hole type Housing (70x70um)

    > Life time 1,5kk

    > Direct docking solution (V93K, Uflex)

    > Easy Replacement and Repair

    > Turn key Solution (PCB+MLO+Probe Head assembly)