CEI Limited

Singapore, 
Singapore
  • Booth: N0880
  • - 4th Floor


Our warmest welcome to all visitors to CEI Limited.

CEI is a reputable contract manufacturer of Printed Circuit Board Assembly ( PCBA ) , Box Build and Equipment Manufacturing.

Focus On very High Mix, very Low Volume Contract Manufacturing Services & Equipment Integrator.

CEI Limited was listed on the main board of the Singapore Exchange Securities Trading Limited in March 2000.

The Company provides printed circuit board and box-build assembly, equipment design, cable harness assembly and manufacturing services. It is well equipped to provide value-added services such as materials management, circuit layout, prototype & development engineering, metal stamping, cable harnessing and precision machined components.

The Company serves customers in the industrial equipment market segment. These include electroluminescence displays used in industrial, transportation and medical applications; medical and health care equipment; office equipment as in digital photocopiers; analytical instruments as in gas and liquid chromatographs and measurement instruments; Aerospace products, Oil and Gas; industrial safety controllers and environmental sensors, semiconductor equipment and SMT equipment.

The Company is ISO9001, ISO13485, ISO14001, AS9100, Nadcap, UL508A and UL817 certified.

Headquartered in Singapore with manufacturing sites in Singapore, Batam (Indonesia), Ho Chi Minh City (Vietnam) and Shanghai (China).

CEI also design and build own brand equipment for the electronics and semiconductors manufacturing industries such as ...

- UV Wafer Eraser Systems

- Wafer Sorter/Packing & Unpacking Systems

- Wafer Macro and Micro Inspection Systems

- 3rd Optical Inspection Machines, for lead frame, substrate (post Die Attach & Wire Bond inspection)

- AGV/mobile robot material handler (fully autonomous, wifi control, lidar sensing)

- Custom Automations

CEI Limited

2 Ang Mo Kio Avenue 12 Singapore 569707

www.cei.com.sg

eqm-sales@cei.com.sg

lowtm@cei.com.sg


 Products

  • CEI BTC8121 Wafer Sorter, Packing & Unpacking
    CEI BTC8121<br />WAFER SORTING SYSTEM<br /><br />Wafer sorting with without packing & unpacking modules. Capable of handling 8" and 12" wafers in a single platform.<br />...

  • CEI BTC8121
    WAFER SORTING SYSTEM
    APPLICATION:
    Wafer sorting/packing & unpacking.
    FEATURES:
    Handle 200mm & 300mm wafers
    Class 1000 cleanliness
    Modular design for future expansion
    Capable of handling wafer thickness > 8mils for 200mm
    Capable of handling wafer thickness > 12mils for 300mm
    Dual Arm Wafer Robot
    Aligner
    OCR
    SECS/GEM full compliance
    Enable full wafer integrity and traceability
    Eliminate human handling
    Reduces wafer loss and improve yield
    Safe, automated environment
  • CEI AWL8121 Wafer Macro & Micro Optical Inspection
    CEI AWL8121 Wafer Macro & Micro Optical Inspection<br />SEMI AUTO Wafer Macro & Micro Optical Inspection Tool.<br />Handle 8" and 12" wafers in a single platform....

  • CEI AWL8121 Wafer Macro & Micro Inspection and Review System

    Applications:

    - Macro & Micro Optical Wafer Inspection and Review System

    - Wafer Transfer/Split/Sort with OCR System

    - Inkless Binning

    Features:

    - Automatic Robot Wafer handling 8" and 12"

    Capability to handle thin wafers

    Multi Functions: Cassette to cassette sort, Cassette to XY stage for Micro inspection

    Inkless binning catered to handle all SEMI STD Wafer Map Format

    Macro Tilting & Spin Module to inspect Frontside & Backside & Edge

    Micro Stage to inspect Die & update with defect code

    Capable to integrate with any OEM Optical Microscope

    Optical Character Reader (OCR) capability

    SECS/GEM capability

  • CEI aMR-08 Automomous Mobile Robot #AIV #AGV #AMR
    CEI aMR-08<br />Autonomous Mobile Robot Material Handler<br />Also available base unit (transporter) only that can be integrated with any top module as needed....

  • CEI aMR-08

    Autonomous Mobile Robot Material Handler

    APPLICATIONS:

    Pick, Transport, Place - SMIF Pod

    H cassette, Reticle Pod, Magazine, etc.

    FEATURES:

    Weight: 180kg

    Robot Payload: < = 5kg

    Robot Reach: 850mm

    Battery: 25.6V / 60AH Lithium-ion

    Run Time: 8 hours

    Battery Charging: Automatic

    CE Compliance

    SEMI S2 Compliance

  • CEI BTC682(T)/BTC682(U) Thin/Thick Wafer Sorter
    CEI BTC682( T )/BTC682( U )<br />THIN/THICK WAFER SORTING / PACKING &<br />UNPACKING SYSTEM...

  • CEI BTC682( T )/BTC682( U )

    THIN/THICK WAFER SORTING / PACKING &

    UNPACKING SYSTEM

    APPLICATION:

    Thin / Thick wafer sorting/packing & unpacking

    FEATURES:

    Capable to handle 150mm and 200mm wafers

    Capable to handle 3 mils to 29 mils (Using Bernoulli’s Arm and Vacuum Arm)

    Capable to handle 13/12/25 slots cassettes / cannisters / jars

    Macro Inspection using camera (Backside inspection)

    Built in Aligner (camera based) / OCR reader

    Enable Full Integrity and traceability

    Eliminate Human handling

    Reduce wafer loss and improve yield

    Safe Automated Environment

    SECS / GEM compliance

  • CEI AER8121 Wafer UV Eraser
    CEI AER8121 Wafer UV Eraser<br />Capable to handle 8" and 12" wafers in a single platform....

  • CEI AER8121 Wafer UV Eraser

    APPLICATIONS:
    Complete wafer erasing for EPROM & Flash Memory
    UV curing and hardening
    Removal of stress induced due to manufacturing processes

    FEATURES:
    200mm & 300mm ready
    Class 1000 cleanliness
    Modular design for future expansion

    Unique UV Grid Lamp for even irradiation
    Capable of handling thin wafer of 12 mils
    SECS / GEM compliance

  • CEI OPT654 3rd Optical Inspection
    CEI OPT654 3rd Optical Inspection<br />Post Die and Wire Bond Inspection - 2D AVI or Semi Auto...

  • CEI OPT654(F )

    3rd OPTICAL INSPECTION MACHINE

    APPLICATION:

    3rd Optical Inspection Machine with

    auto conversion.

    FEATURES:

    Flexible to handle both lead frame & substrate

    One touch auto conversion

    Strip mapping for reject traceability

    Reject Identification (Wire breaker/inking/scribing)

    Fine pitch capability for 1x1mm device

    Angular tilting mechanism to check bonding quality

    SEMI/CE compliance

    Networking capability - SECS/GEM

    2D vision inspection for Wire & Die (Option)