Great Domain Enterprise Co., Ltd.

Panchiao, Taipei, 
Taiwan
http://www.great-domain.com.tw
  • Booth: M0448
  • - 4th Floor


We are the best solution provider!

Great Domain was established in 1981, We are professional agency for several fields, including semiconductor, IC assembly, discrete, photoelectronics, nano-technology, LED products, storage media and corresponding materials and parts service, for 30 years. Great Domain Enterprise has introduced numerous leading technologies and products to Taiwan and China market. Branch offices, Taipei office, Hsinchu office, Kaohsiung office and Shanghai branch (Whole-Link International Co. Ltd.), ShenZhen office as well as Taipei Headquarter play an important role to satisfy all customers in both Taiwan and China or other foreign areas.

 Products

  • Automatic Ultrasonic Metal/Wire Bonding Machine
    Rebo-Metal-S and Rebo-9 series are widely used in the field of automotive industry and power module industry. Our machines are designed and engineered in-house with highest quality standard. 100 % made in Japan....

    • Rebo-9 Series 打线机

    • 高频率打线: 使用110kHz實現更短時間更高品質的接合效果。
    • Power/Force 分段控制。
    • P/R 多点辨识。
    • 实时品质管理可记录多种波形。（下沉，VCO，电流，电压，位相，电力）
    • 非破坏拉力测试。
    • 耗材更换专用检视系统。
    • CCD 变形量判定。
    • 弧形成型器。

    Rebo-Metal-S 金属键合机

    • X Y θ Z轴可动机构。
    • 通过辨识装置对接合点进行修正，实现任意位置的接合。
    • 伺服荷重机构最多可分4段荷重加压。
    • 实时品质管理可记录多种波形。（下沉，VCO，电流，电压，位相，电力）
    • 丰富的治具设计及开发经验，帮助节约工装工时。提高产能。
  • Burn-in & Test Socket
    Over 3,500 designs, 1,300+ QFN designs. Fine Pitch, Kelvin, Non-Magnetic, Humidity, HAST, Compression and Plated Thru-Hole Contacts.Sold-free sockets for QFN, BGA, LGA and other packages with pitches down to 0.22mm.<br />...

    • Loranger Socket Families: QFN-MLF-LLP / BGA-CSP-LGA / Other Socket Types

    QFN-MLF-LLP Socket Features: (Over 1,300 QFN Socket Designs)

    ．0.22mm Pitch and Up

    ．Dual Row

    ．Non-Magnetic Option

    ．Double Duty Kelvin

    ．PTH / Clam Shell or Open Top

    ．SMT / Compliant Cover

    ．Thermal Management

    BGA-CSP-LGA Socket Features: (Over 700 BGA / CSP / LGA Socket Designs)

    ．Micro-spring / APS Contacts

    ．0.22mm Pitch and Up

    ．Current Rating: Up to 1AMP / Contact

    ．Frequency: 5 GHz

    ．Life Time: Over 50,000 Cycles

    ．Non-Magnetic Option

    ．Clam Shell Style

    ．SMT/Compliant Cover

    ．Thermal Management

      ．Heat Sink

      ．RTD-Heater

    ．Programmable Smart Socket

    Wide Range of Socket Styles

    Burn-in and Kelvin Test Designs

    ．Gull Wing

    ．TO

    ．SMD

    ．ZigZag

    ．Microwave / Hybrid

    ．LCC /PLCC

    ．Axial / Radial / MELF

    ．SIP / DIP

    ．Optical Transceiver

    ．Connectors
  • Memory & Logic Change Over Kit (COK)
    TFE’s Memory COK is applicable to Advantest, Mirae, SEMES, Techwing handlers and Logic COK is applicable to Epson, Synax, Delta, Hontech, Chroma handlers.<br />TFE’s COK provides various solutions for alignment for fine pitch PKGs, conversion, etc.<br />...

    • Memory COK

    – Alignment Solution for Fine Pitch PKGs such as 0.3mm Pitch BGA

    – Fast and easy converting solution (Reduced 60%) for M6242 COK

    – Common Kit development : UPC, UMC

    Logic COK

    – Up to 16 Parallels with various spec. Surface resistivity of 1.0E+6 ~ 9, Al with special anodizing

    – Fast and convenience changing of test sockets with MIK solution for 8 and 16 Parallel COK

    – High Yield CCU and Low Force Contact Solution development

Categories

208 Equipment, Test
  • Parametric Test Systems
  • Package Test Systems
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
    • 200 Equipment, Assembly
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Lead Frame Taping Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Marking; Imprinting; Labeling Equipment
  • Plating; Electro Chemical Plating for device assembly
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 203 Equipment, Inspection & Measurement
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Microscopes: Atomic Force Microscopes (AFM)
    • 207 Equipment, Process
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
    • 300 Materials, Assembly
  • Marking ink
  • Solder; Solder Balls and other Soldering Materials
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
  • Dopants; liquid or solid
    • 304 Materials, Mask Making
  • Pellicles; Mounting Fixtures
    • 309 Materials, Test
  • Test Sockets; Contactors and Contact accessories
    • 400 Components, Parts & Accessories
  • Flow Control Components - Valves; Meters; Gauges; Regulators; MFC's
  • Motors; Fans; Electric Rotary Spindles
  • Vacuum Systems Components & Accessories (optical monitors; Sputtering target fixtures; lubricants; p
    • 401 Sub-systems
  • Cameras - Still; CCD; Video & Monitors
  • Electron tube & Ion Beam Apparatus & Sources
  • Ultrasonic Generators; Transducer and Monitoring Systems

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