Yamaha Motor Robotics Holdings Co., Ltd

Compression mold / 壓縮成形模壓設備

    WCM-330
     WLP Molding System
     [WLP成型模壓系統]

    LPM-600
     Large Panel Compression molding system
     [大型基板壓縮成型模壓裝置]

    SCM-100G
     Strip compression molding system
     [基板壓縮成型模壓裝置]

Transfer Mold / 注塑成型模壓設備

    GTM-X
     High performance molding system
     [高性能封裝模壓裝置]

    GTM-S
     Standard auto-molding system
     [標準封裝模壓裝置]

    GTM-170T
     Molding system for large scale module
     [適用於大模組的成型模壓系統]

Trim & Form System / 切斷成形設備

    COMBO-300SW D/D
     Dambar and Dejunk System
     [D/D切斷成形裝置]

    COMBO-300SW T/F
     Trim & Form System
     [T/F切斷成形裝置]

Die Bonder / 貼片機

    SPA-1000
     High-Accuracy Twin-Head Die Bonder
     [高精度雙機頭貼片機]

    STC-800
     Discrete Application Die Bonder
     [用於Discrete貼片機]

Wire Bonder / 焊線機

    UTC-5000NeoCu Super
     High-speed wire bonder with new SimLoop function as standard capability
     [標準搭載新功能「SimLoop」的高速銅線焊線機]

    UTC-5000WE NeoCu
     UTC-5000NeoCu Super basis configuration with wider substrate capability (100mm width)
     [UTC-5000 NeoCu super 作為平台，可生產更寬幅度基板的機型(~100mm width)]

    UTC-5100
     High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability
     [可對應寬大框架、適用於生產LED、Discrete的高速焊線機]

Bump Bonder / 植球機

    SBB-5200
     Wide Area Handling High-speed Wafer Bump Bonder
     [對應晶圓的工作區域寬的高速植球機]

Flip Chip Bonder / 倒裝貼片機

    FPB-1 NeoForce
     Package Bonder for Multiple Processes
     [對應Multi process的靈活封裝貼片機]

    LFB-1102Super
     Flip Chip Bonder for TCB process
     [Substrate用TCB工藝的倒裝貼片機]

    LFB-2301
     Flip Chip Bonder for TCB process
     [Wafer用TCB工藝的倒裝貼片機]

    YSB55w
     High-Speed & High-Accuracy Flip Chip Bonder
     [高速・高精度倒裝貼片機]

Camera Module Products / 相機模組製造設備

    HM-A200
     Active Alignment Bonder
     [全自動鏡頭搭載機]

    HM-A100D
     Active Alignment Bonder for dual cameras
     [雙攝像頭用全自動鏡頭搭載機]

    HM-50
     Lens Holder Mounter
     [模組搭載機]

Crystal Devices / 石英裝置製造設備

    PBM-1100
     Blank Mounter
     [點膠機]

    PMI-21
     Mask Placer
     [排片機]

    PTTA-C5Z Ⅱ
     Temperature Characteristic Inspection Equipment
     [溫度特性測試設備]

    PLT-20
     Frequency Adjustment Equipment
     [頻率調整機]

Flat Panel Display Products / FPD製造設備

    FPD-I1300
     Indentation Inspection Machine (AOI)
     [壓痕檢查設備(AOI)]

    FPD-IMS1400
     Automatic Optical Inspector for FPD bonding
     [壓痕檢查設備(AOI)]

SMT ASSEMBLY SYSTEM / 電子元件貼裝相關設備.貼片機

    YRM20
     Premium High-efficiency Modular
     [高端高效模塊貼片機]

    Z:LEX TSM20R/YSM20WR
     High-efficiency Modular
     [高效模塊貼片機]

    YSH20
     Hybrid Placer Intelligent Cubic
     [高速、高精度、倒裝晶片貼片機]

    YST15
     Intelligent SMD Storage System
     [智能SMD倉儲系統]

    YSP10
     Premium printer
     [高性能小型印刷機]

    YSD
     High-speed Dispenser
     [高速點膠機]

    YSi-SP
     3D Solder Paste Inspection Machine
     [3D高速錫膏印刷檢查機]

    Ysi-V
     High-end Hybrid optical inspection system (AOI)
     [高端混合型光學式外觀檢查裝置]

Industrial robots / 工業機器人

    YK-X
     SCARA robots
     [水準多關節機器人]

    YA
     Articulated robots
     [垂直多關節6軸及7軸機器人]

    LCM
     Linear Conveyor Modules
     [線性傳送模組]

    TRANSERVO/FLIP-X//GX/YLE
     Single axis robots
     [單軸機器人]

    PHASER
     Linear motor single axis robots
     [線性馬達單軸機器人]

    XY-X
     Cartesian robots
     [直交機器人]

▶ New Taiwan R&D Laboratory

▶ Packaging Evaluation

▶ Location / Access

▶ Heterogeneous Integration

                             ...Connect to the staff