YXLON International GmbH

  • Booth: L0416
  • - 4th Floor

Led by experience. Driven by curiosity.

YXLON International designs and produces radioscopic and CT inspection systems for a broad variety of industrial applications and fields. Whether in the aviation and aerospace, automotive, or electronics industry, our customers are among the largest manufacturers in the world – major enterprises that place their confidence in our outstanding quality. Our roots go back to the discovery of the X-rays by Wilhelm Conrad Röntgen in 1895 and the construction of the first X-ray tube by Carl Heinrich Florenz Müller in Hamburg in 1896.

With headquarters in Hamburg, we have sales and service locations in Yokohama, Hudson (Ohio), San Jose (California), Beijing, Shanghai, and Hattingen, as well as a network of representatives in over 50 countries. At YXLON we are local for our customers all over the world.


    World’s best resolution 3D X-ray inspection system for fully automated verification of IC packaging defects...

  • The perfect solution for high-volume, automated and reliable semiconductor joint analysis

    The YXLON FF65 CL is distinguished by its large inspection area of 510 x 610 mm and the detectability of < 300 nm, making it ideal for automatically and non-destructively analyzing solder bumps and filled vias in 3D ICs, flip chips and wafers.  The innovative vacuum mechanism of the system manipulator holds the sample securely and precisely during analysis and counteracts the effects of sample warpage. 

    The FF65 CL provides 2D (top-down) with a high-performance flat-panel and 3D (CL – Computed Laminography) automated analysis using a high-resolution Image Intensifier within a special manipulation assembly for its inclined rotations.The latest generation of nano-focus X-ray tubes creates 2D and 3D images that can reveal and measure the smallest voids and features. This enables the YXLON FF65 CL to analyze the most demanding advanced semiconductor challenges. 

    A user-friendly and intuitive graphical user interface (GUI) allows the easy creation of automated, multi-point and multi-functional analysis inspection programs. 

    Measurement repeatability over time is ensured by automatic, continuously monitoring background calibration tests over all aspects of the system.

  • YXLON Cheetah EVO
    Scalable x-ray inspection system for semiconductor applications...

  • The Cheetah EVO range was created to achieve a simple goal: the very best image in the shortest time, in each of the electronics market sectors. With 3 different systems, each custom built for either SMT, semiconductor, or laboratory, users get the best solution for their specific and demanding application.

    Cheetah EVO Semi harnesses the combined power of several YXLON innovations - FeinFocus X-ray tube technology, High Power Target technology, a finely calibrated, long-life flat-panel detector, and a manipulator with cushioned bearings. The variety of sample tables ensures that it can generate 2D and 3D images in extremely high resolution.

    In addition to imaging excellence, you can look forward to simple, user-friendly controls and YXLON FGUI - FeinFocus Graphical User Interface - software, not to mention the myriad benefits of comprehensive automation. One-click solutions make manual inspections effortless, while Easy Teach-In makes it simple to program the automated procedures that guide the operator swiftly through inspections - and deliver repeatable and reliable results.

    Cheetah EVO Semi can be upgraded for CT with the optional microCT module. This enables CT for industrial quality assurance, with in-depth 3D examination of inspection items via virtual cross sections and layers. With its user-friendly YXLON QuickScan® module, it delivers 3D images and virtual slices within a minute.


    • Wafer inspection
    • 3D integrated circuit joints
    • Microbumps
    • Sensors
    • MEMS and MOEMS
    • TSVs

    Benefits for Semiconductors

    • Accurate, repeatable void compilations, including multi area voiding
    • Excellent resolution at low power and low kV
    • Fast, automated, easy routines
    • Very fast live (on the fly) inspections

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