Capture many views, many data types, with a single scan.
Sonix technology provides the flexibility to acquire many different views of the sample using a single scan. Multiple layers can be captured simultaneously (TAMI) as well as multiple types of data (C-Scan, Phase, Void, TOF). These layers can be used to analyze packaged dies, strips, trays, bonded and unbonded wafers, stacked wafers, stacked dies, dies on wafers and FOWLP.
Our analysis is flexible, recognizing that each layer of your sample is different. Analyze each layer of your sample (either package or wafer) using different techniques and different parameters for each one.
Handling Patterned Wafers
Patterned wafer process quality can be measured across the entire wafer as well as at an individual device level. Sonix provides several techniques for locating devices within a wafer image. Device locations are applied to all captured layers of a wafer – devices are found on one layer and this location information is then used across all layers during analysis. Once identified, devices are masked for individual analysis. Within each device cell any number of regions of interest (ROIs) can be specified and analyzed individually. Just as with device locations, regions of interest are also applied across all layers.