EO Technics is a global total laser solution provider.
EO Technics is the worldwide leader in the laser-based application industries. With more than 30 years of dedication in developing laser technologies & applications. EO Technics is providing the qualified products and the very speedy commercialization to the world-wide customers’ requirements with the various product ranges from the front end upto the back end equipment which are including:
Wafer Laser Annealing, Wafer Grooving / Dicing and Drilling Machine, WLCSP Wafer Back Side Marker, Wafer Top Side Marker (including Wafer ID Marker), EMC Package Ablation and Drilling Machine, all kinds of SEMI and Non-SEMI purposed Laser Markers (Fundamental IR / Green / UV / CO2) with and/or without Built-in Vision, Laser Cleaner, Laser Soldering & Welding Machine, LCD Trimming System (Laser Short Ring Cutter), GLA, Titler and Edge Exposure, ITO Patterning System, Laser Dry Etching System, Glass Marker, Laser PCB Via Hole Driller (CO2 / UV), Embedded PCB Laser Trimmer, PCB Strip & Panel Marker, PCB Cutter and Thin Film Solar Cell Laser Scriber & Edge Deleting System, Crystalline Laser Doping Machine & Isolator... etc.
And, especially, EO Technics is applying to the multi-beam solutions for laser markers, laser wafer grooving machines and laser drilling systems which can provide the cost- effective production.
EO Technics has its headquarter in Anyang, Korea, as the world-wide international corporate center and has its branch offices in Taiwan, China, Singapore, Philippines, Thailand, Malaysia, Japan, India, Vietnam and USA to provide all EO customers with the truly global services.