Incorporating degas, etch and PVD sputter technologies, Evatec's CLUSTERLINE 600 delivers excellent adhesion and low Rc in processes like FOPLP and IC substrate processing at the levels seen in wafer based processes. Robust cluster architecture and efficient process flow ensure run rates of 24 panels per hoour. Static panels duing proces steps ensure low particles and high process yields. Visit the Evatec booth to find out why
CLUSTERLINE 600 is already qualified at the major OSATS and IDMs for Panel Level Pckaging. To learn more about Evatec solutions for Advanced Packaging
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