Grace Haozan Applied Material Co., Ltd

Taipei, 
Taiwan
http://www.gracehaozan.com
  • Booth: J2653
  • - 1st Floor


welcome the electricity takes the correlation data

Polishing Powder Silicon Carbide Aluminum Oxide I.D Saw Coolants Lapping Vehicles Diamond Powder Polishing Slurries Glass Power Cerium Oxide Nut Shell Deflashing Media

 Products

  • Silicon Carbide
    ​Silicon Carbide microgrit is sharply cutting edge, longer life in recirculating wire sawing, cutting and lapping process application....

    • Silicon Carbide microgrit is sharply cutting edge, longer life in recirculating wire sawing, cutting and lapping process application.
    Semiconductor and compound semiconductors
    Single crystal silicon
    GaAs , InP
    LT , LN
    Quartz
    Aluminum Nitride 
    Synthetic single crystal ingot / boules
  • Wire sawing , diamond slurry ,mineral oil
    Wire sawing , diamond slurry , mineral oil , grinding coolants consumables for SiC boules sawing and grinding...

    • Wire sawing , diamond slurry , mineral oil , grinding coolants consumables for SiC boules sawing and grinding

  • High purity ceria blank slurry,
    High purity ceria blank slurry, ceria abrasive CMP powder 50nm, 80nm, 100nm, 200nm. High purity Alumina polishing powder 1.5um, 1.0um, 0.8um, 0.3um, 0.1um...

    • High purity ceria blank slurry, ceria abrasive CMP powder 50nm, 80nm, 100nm, 200nm. High purity Alumina polishing powder 1.5um, 1.0um, 0.8um, 0.3um, 0.1um
  • Aluminum oxide lapping, polishing powder
    Aluminum oxide lapping, polishing powder for Silicon, Quartz, stainless, optical glass, super hard steel...

    • Aluminum oxide lapping, polishing powder for Silicon, Quartz, stainless, optical glass, super hard steel
  • Lapping Suspension Vehicle, I. D. Saw Coolant
    Lapping Suspension Vehicle for semiconductor wafers. I. D. Saw Coolant for slicing, edge grinding, rod grinding and boule grinding....

    • Lapping Suspension Vehicle for semiconductor wafers. I. D. Saw Coolant for slicing, edge grinding, rod grinding and boule grinding.

  • Glass wafer Ø8” Ø12” . SiC wafer Ø4” Ø6”
    Glass wafer Ø8” Ø12” . SiC wafer Ø4” Ø6”...

    • LGlass wafer Ø8” Ø12” . SiC wafer Ø4” Ø6”

Categories

902 Other
  • Other
    • 308 Materials, Substrate
  • Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.)
  • Diamond substrates
  • Prime; Polished; Mirrored Wafers
  • Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;
  • solar cell substrates; crystalline silicon (c-Si); thin film

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