Ever Team International Corp.

Hsinchu, 
Taiwan
http://www.everteam.com.tw
  • Booth: N0176
  • - 4th Floor

Welcome to Ever Team booth #140

Ever Team International Corp. is a leading global provider of equipments and material solutions from front-end to back-end in IC, LED, Solar and Electronic industry. Our mission is to ensure that Ever Team continues to be the essential resource for Semiconductor applications. Exhibiting with H-Square, Indium Corp of America, KED, Kempur, Porvair,  NFT, Lord, Protec, SEMES, Tango System,  Zestron.

Categories

101 Photovoltaic Device Manufacturing
  • PV: Modules
  • PV: Stand-Alone Systems
  • Solar Thermal
  • PV: Cells
    • 200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Deflashing; Degating Tools
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Plating; Electro Chemical Plating for device assembly
    • 201 Equipment, Flat Panel Display
  • Liquid Crystal Injection or Filling Equipment
    • 202 Equipment, General Use
  • Lamination; Sheet Laminating Equipment
  • Vibration Isolation Systems
    • 203 Equipment, Inspection & Measurement
  • Flat; Notch Finding System
    • 206 PV Equipment
  • Wafers
    • 207 Equipment, Process
  • Bumping Systems
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Plating; Electro Chemical Plating; Deposition Systems
  • Transfer Systems for Wafer; Reticles or FPD's
    • 300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Lead Frames & Headers: Etched; Stamped
  • Molding; Encapsulation; Potting; Resin Materials
  • Package Substrates; Laminate; Film based
  • Packages; Ceramic and Other High Temp Compounds
  • Preforms; Lids
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Solder; Solder Balls and other Soldering Materials
  • Thermal Interface Materials; Heat Sinks
  • Thick Film Pastes; Materials
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
    • 304 Materials, Mask Making
  • Mask and Reticle Handling Products
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
  • Plating Materials
    • 308 Materials, Substrate
  • Test; Monitor Wafers; Reclaim or Virgin
    • 309 Materials, Test
  • Test Sockets; Contactors and Contact accessories
    • 400 Components, Parts & Accessories
  • Filters, Getters, Purifiers, Catalysts for Gases
    • 401 Sub-systems
  • Temperature Sensing; Control; Recirculators; Chillers; Heat Exchangers
    • 502 Material Handling Systems
  • Robotics; Transfer Systems
  • Stockers; Storage, AMHS
    • 700 Manufacturing Services
  • Plating; Electro Polishing; Coating; Surface Treatment
    • 701 Manufacturing Services or Consulting
  • Wafer Handling

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