ATECOM TECHNOLOGY CO., LTD

Taipei, 
Taiwan
http://www.atecom.com.tw
  • Booth: I2812
  • - 1st Floor


We manufacture and customize the wafer material for you!

Atecom Technology Co., Ltd is the manufacturer and supplier of semiconductor materials established Taipei Taiwan in 1998.

We manufacture and cooperate with our partners for the various crystals on Semiconductor and Compound materials like Silicon ingots/wafers, Epitaxial wafers, Solar wafers, Sapphire, GaAs, SiC, GaN, InP and Ge wafer for applications to Optoelectronics, MEMS, LED, Power devices, Solar modules and IC’s.

In the meantime, we keep expanding our product lines to the field of Sputtering Targets, Aluminium oxide, Germanium (GeCl4) materials in order to provide more services and choices to our customers.

 Products

  • Silicon wafer
    Silicon wafer is the most common material and widely used for a variety of high-tech industries, including integrated circuits , detector or sensor device , MEMS fabrication, opto-electronic components, and solar cells ....

    • Growth method：CZ, CFZ, MCZ, FZ, NTD
    Type/Dopant：N/Arsenic/Sb/Phos/Red Phos, P/Boron
    Diameter：2”, 3”, 4”, 5”, 6”, 8”, 12”
    Orientation : <100>, <111> , <110>
    Surface：As cut, Lapped, Etched, Polished.
    Other specs per customer requirement
  • SiC WAFER
    Slicon Carbide, These unique properties of SiC can apply to variety applications like Power electronic switches,RF, LED technology and Hybrid Electric vehicles....

    • Diameter: 2",4”,6”
    Type: 4H-N, 4H-SI
    Thickness: 350~550 um,
    customizable
    MPD : <1, <5,<15
    Surface: EPI-Ready Polish Wafer
  • GaN wafer
    GaN is the leading new material for RF & Power application...

    • Diameter : 2”~8’’
    Product : III-Nitride based HEMT epitaxial wafer
    Orientation： C-axis(0001)
    Substrate Type: Silicon, Sapphire, SiC
    AlGaN/GaN Thickness: 2~50nm
    Sheet resistance:<400Ω/□, Customizable

Categories

101 Photovoltaic Device Manufacturing
  • PV: Cells
  • PV: Modules
    • 203 Equipment, Inspection & Measurement
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
  • Ingots
    • 308 Materials, Substrate
  • Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.)
  • Diamond substrates
  • Epitaxial; Epi; Gettered; Internal Gettered Wafers
  • Gallium Arsenide (GaAs); Sapphire Substrates
  • Prime; Polished; Mirrored Wafers
  • Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;
  • solar cell substrates; crystalline silicon (c-Si); thin film
  • Strained silicon; Engineered Substrates
  • Substrate Materials
  • Test; Monitor Wafers; Reclaim or Virgin
  • Thin & Thick film substrates for MEMS
    • 701 Manufacturing Services or Consulting
  • Wafer Handling
    • 900 Support Products
  • Device; Wafer; Display Panel Handling Products

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