Sonix Inc

Zhubei City, 
  • Booth: L0426
  • - 4th Floor

the Ultrasonic Expert! Collaboration. Insight. Advantage.

Since 1986, Sonix has pioneered many of the breakthroughs in image accuracy & process productivity that have helped wafer & chip manufacturers literally transform the world. We consistently found the right answers to very difficult problems. 

Today, Sonix acoustic scanning microscopes are used by leading manufacturers globally to perform nondestructive inspection of bonded wafers & packaged semiconductors, from the development lab to the production floor. These high performance systems deliver the high-resolution images & advanced diagnostic tools that semiconductor designers and fabricators need to verify reliability, qualify new designs, monitor production & improve process control.

Technology innovation & leadership are our core. We make substantial R&D investments, and developing novel solutions to meet evolving market demands.  We collaborate with our customers to address today’s needs & tomorrow’s innovations.

Together with Tektronix, whom become our parent company since Jan/2017, we co-invent with the engineering team alot of breakthrough technology for inspection world. We have changed the world since in terms of metrology and non-destructive inspection for R&D, FA and even production customers.

Clearer & superior imaging, greater & faster throughput, swifter responsiveness — that’s few of Sonix's advantages among the others to maintain our market leadership position.


  • Latest Pulser Receiver for clearer imaging!
    THE CHALLENGE<br />Getting even better signal quality and image<br />resolution to detect the smallest defects in<br />semiconductor packages and bonded wafers....

    Exclusive pulse2™ pulser/receiver from Sonix™ with proprietary technology for all ECHO™ and AutoWafer™ systems.
    THE pulse2™ PROOF
    (1) +12 dB gain compared to standard pulser/receivers 4x improvement in signal-tonoise ratio (SNR)
    (2) Separates signals from low-level background noise in the signal path
    (3) Generates clean, clear images even with ultra-high-frequency transducers
    (4) Supports higher-frequency pulse echo and through transmission (TT) images for improved resolution of features/defects
    (5) Optimizes scanning acoustic microscope (SAM) performance
    (6) Provides optimum image quality for all wafer and packaged semiconductor inspection applications
  • New High Resolution Wand!
    Best in class Through Transmission Wand with higher durability and clearer imaging for all types of semiconductor samples!...

  • With new improved designed, the new HR wand provides a higher resolution version of Through Wand. 

    The benefits include:

    - Easier alignment (not have to worry about wand rotating as tightening)
    - Quicker alignment
    - Higher Resolution 25 MHz wand
    - Easily upgradable on Echo systems
    - Extended wand kit option with new flexible fixture

  • Sonix New Analysis
    Come visit us to review how we can help in terms of making exclusive and customized analysis to your devices, strips or wafers!...

  • Capture many views, many data types, with a single scan.
    Sonix technology provides the flexibility to acquire many different views of the sample using a single scan. Multiple layers can be captured simultaneously (TAMI) as well as multiple types of data (C-Scan, Phase, Void, TOF). These layers can be used to analyze packaged dies, strips, trays, bonded and unbonded wafers, stacked wafers, stacked dies, dies on wafers and FOWLP.

    Flexible Analysis
    Our analysis is flexible, recognizing that each layer of your sample is different. Analyze each layer of your sample (either package or wafer) using different techniques and different parameters for each one.

    Handling Patterned Wafers
    Patterned wafer process quality can be measured across the entire wafer as well as at an individual device level. Sonix provides several techniques for locating devices within a wafer image. Device locations are applied to all captured layers of a wafer – devices are found on one layer and this location information is then used across all layers during analysis. Once identified, devices are masked for individual analysis. Within each device cell any number of regions of interest (ROIs) can be specified and analyzed individually. Just as with device locations, regions of interest are also applied across all layers.

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