SUSS MicroTec (Taiwan) Co., Ltd.

Hsin-Chu City, 
Taiwan
http://www.suss.com
  • Booth: N0376
  • - 4th Floor


Welocome to SUSS MicroTec's booth No. 376

The SUSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. 

Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.


 Products

  • ACS300 Gen2 Coater & Developer
    Concurrent 200 and 300mm wafer processing without mechanical changeover<br />High-speed, high precision six-axis robot and optical centering<br />Excellent thick resist capabilities and best-in-class EBR performance...

  • Production Spin Coat / Develop Cluster for Wafer Level Packaging

    The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput and modular photolithography processing for 200 and 300mm wafers. Both wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB).

    SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.

    ACS300 Gen2 allows flexible production planning from R&D/pilot production to the volume production stage. A small footprint configuration comes with 2 load port modules directly attached to the basic frame which guarantees for optimum cost-of-ownership. With a separate EFEM the machine can be equipped with 4 load port modules. It is equipped a high-precision 6-axis robot and camera based centering. With the GYRSET feature highly uniform resist layers with thicknesses from below 1µm to over 100µm can be produced in the process bowl.

    The ACS300 Gen2 can be interfaced with the MA300 Gen2 proximity mask aligner to form the integrated LithoPack300 cluster.

  • ACS200 Gen3 Coater & Developer
    Unmatched configuration flexibility<br />Serving HVM and R&D in Advanced Packaging, MEMS and LED markets<br />Highest process module count of any 200 mm coater / developer on the market...

  • Combining Expertise with Innovation

    The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.The versatile base frame provides multiple configuration possibilities, e.g. up to 4 wet process modules (either coater and /or developer) with up to 19 plates or 2 wet process modules and 2 spray coater modules with up to 13 plates.

    With the possibility of stacking up to 3 plates over each wet process module and up to 7 plates in the 5th module, the ACS200 Gen3 allows the maximum module count in its class.

    Different I/O systems match with any need. The 2x I/O serves R&D requirements, whereas the new designed auto load cassette station enables a continuous operation without stopping the system for cassette exchange.

    The novel coater bowl offers state of the art open bowl coating and the patented GYRSET® closed cover coating technology. The bowl design offers the possibility to use disposable process bowls for operation without compromising in flow dynamics or exhaust flows. It simplifies operation with inconvenient or unusual materials due to easy cleaning of the bowl and reduced maintenance time. The possibility to separate the solvent and resist lines on 2 different dispense arms per coater module, the ACS200 Gen3 follows consequently the path on providing excellent yield.

    For developing applications, either an aqueous or solvent developer module can be configured. A high variety of different nozzle types are available to match with any process requirement.

    The direct connection to a SUSS exposure system increases yield as no operator interaction is necessary for a complete lithography process flow.

    Optional filter fan units and temperature / humidity control of the tool results in process stability, reproducibility and finally in a high yield.

  • PiXDRO Inkjet printing
    Inkjet printing is an additive manufacturing technology applying functional materials for a variety of applications....

  • PiXDRO Inkjet printing

    Inkjet printing is an additive manufacturing technology applying functional materials for a variety of applications. These functional materials can have dielectric, conductive, adhesive, mechanical, optical or chemical properties, and are printed with pico-liter sized droplets from a digital file.

    Its precise drop placement and accurate drop volumes make functional inkjet printing suited to printed electronics, displays, OLED, sensors, PCBs, semiconductor assembly, chemical machining, photovoltaics, life science and optics.

    Inkjet printing can create fine features down to 20 micron, and replace techniques such as lithography, screen printing, spray coating and dispensing. There is no more need for masks and screens, significantly saving material usage and enabling short product changeover times.

    With a typical distance between the substrate and the inkjet head of just under 1 mm, inkjet is a non-contact deposition technology. So, there is no risk of damaging fragile substrates. Inkjet can also deposit on top of existing 3D topology and fill trenches and cavities, which is a challenge for traditional techniques like screen printing.

    Accurate, versatile and fast

    Inkjet printing is very versatile. It can be used for direct material deposition for patterned or homogeneous coatings, from tens of nanometers to tens of micrometers. It can also be used as a 3D printing method.

    As a non-contact deposition technology, inkjet is suitable for fragile and 3D substrates. It can fill trenches and cavities, and is excellent for direct printing of etching and plating masks.

    Because industrial printheads have numerous parallel nozzles, and operate at very high frequencies, inkjet achieves very high throughput. The PiXDRO mass production inkjet printers can hold arrays of multiple printheads, enabling high productivity and flexibility.

    PiXDRO inkjet printers for R&D and production

    The PiXDRO systems have a modular design, which enables a large degree of customization without compromising reliability and lead times.

    The LP50 research and engineering printer excels in flexibility and process control, offering fast product development and time-to-market. The JETx production systems are designed for high productivity and reliability, low cost of ownership and integration in highly automated mass production environments.

  • XBS300 Temporary Bonder
    XBS300 platform for temporary bonding represents the next generation of high volume manufacturing temporary bonder solutions. The 200/300mm wafer bonding platform can be configured for low cost of ownership and maximum process flexibility....

  • Universal Temporary Wafer Bonder for High Volume Manufacturing

    SUSS MicroTec‘s XBS300 platform for temporary bonding represents the next generation of high volume manufacturing temporary bonder solutions. The 200/300mm wafer bonding platform can be configured for low cost of ownership and maximum process flexibility.The XBS300 supports all key process steps for temporary bonding: release layer formation, adhesive coating, low force wafer bonding, UV curing or thermal curing and cooling. Thanks to its flexible configuration the XBS300 is able to process all commercially available temporary bonding adhesives(1).

    (1) The DuPont HD3007 Process is qualified on the XBC300 equipment platform.

  • Photomask Equipment
    Improves time-to-market<br />Increases mask lifetime<br />Maximizes scanner uptime<br />Reduces cost-of-ownership<br />Maximizes yield...

  • MaskTrack Pro Series

    Next-Generation Lithography for Photomask Clean, Bake and Develop

    MaskTrack Pro solves next-generation lithography roadmap requirements for photomask cleaningbake and developing. MaskTrack Pro is designed to balance the most stringent conditions of 193i 1x nm half-pitch (hp) DPT, extreme-ultraviolet lithography (EUVL) and nanomprint lithography (NIL) processing with innovative techniques to maximize mask performance.

    With mask integrity playing a greater part in the success of advanced lithographic processing, MaskTrack Pro is the only platform that is specifically designed in respect to EUVL. It is extendable to allow tool clustering with third-party products for a holistic approach to storage, handling and processing of the mask in a fully-controlled and ultra-clean environment. Its modular platform guarantees maximum flexibility and customization. With its highest first pass cleaning yield, MaskTrack Pro has been accepted as the platform of choice in the industry.

  • PiXDRO Inkjet printing
    Inkjet printing is an additive manufacturing technology applying functional materials for a variety of applications....

  • PiXDRO Inkjet printing

    Inkjet printing is an additive manufacturing technology applying functional materials for a variety of applications. These functional materials can have dielectric, conductive, adhesive, mechanical, optical or chemical properties, and are printed with pico-liter sized droplets from a digital file.

    Its precise drop placement and accurate drop volumes make functional inkjet printing suited to printed electronics, displays, OLED, sensors, PCBs, semiconductor assembly, chemical machining, photovoltaics, life science and optics.

    Inkjet printing can create fine features down to 20 micron, and replace techniques such as lithography, screen printing, spray coating and dispensing. There is no more need for masks and screens, significantly saving material usage and enabling short product changeover times.

    With a typical distance between the substrate and the inkjet head of just under 1 mm, inkjet is a non-contact deposition technology. So, there is no risk of damaging fragile substrates. Inkjet can also deposit on top of existing 3D topology and fill trenches and cavities, which is a challenge for traditional techniques like screen printing.

    Accurate, versatile and fast

    Inkjet printing is very versatile. It can be used for direct material deposition for patterned or homogeneous coatings, from tens of nanometers to tens of micrometers. It can also be used as a 3D printing method.

    As a non-contact deposition technology, inkjet is suitable for fragile and 3D substrates. It can fill trenches and cavities, and is excellent for direct printing of etching and plating masks.

    Because industrial printheads have numerous parallel nozzles, and operate at very high frequencies, inkjet achieves very high throughput. The PiXDRO mass production inkjet printers can hold arrays of multiple printheads, enabling high productivity and flexibility.

    PiXDRO inkjet printers for R&D and production

    The PiXDRO systems have a modular design, which enables a large degree of customization without compromising reliability and lead times.

    The LP50 research and engineering printer excels in flexibility and process control, offering fast product development and time-to-market. The JETx production systems are designed for high productivity and reliability, low cost of ownership and integration in highly automated mass production environments.


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