UDM SYSTEMS LLC

RALEIGH,  NC 
United States

  • Booth: M0858
  • - 4th Floor

UDM Systems®, LLC is a global chemical manufacturing company based in the United States. We offer high-performance water-based, eco-friendly fluid that are suitable for many industries, such as Semiconductor, Solar, Optoelectronics, Biomedical, LED, Precision Glass & Optics, and much more.

Backed by more than 20 years of experience, we are confident that we can help you with all your semiconductor and solar wafer-die needs, we look forward to sharing with you in SEMICON 2020:

  1. Electronic grade cleaner for multi purposes: FLC200-9 series.
  2. Lubricant for cutting Super-hard wafer (GaN, SiC): the newly developed L300-D5CMOS_B series.
  3. Dicing lubricant additive of high-efficacy: L300 series.
  4. Laser coating material: LWC600 series.
  5. Accurate dispensing technology: LDS2000 and ADU-14E1. 

 


 Products

  • ADU-14E1 & LDS 2000
    The ADU 14E1 and LDS 2000 dispensers are electrically synchronized to the dicing saws to dispense lubricants into saw DI water line.<br />...

  • ADU-14E1 & LDS 2000 Fully Automated Dicing Fluid Dispensing Unit

    The ADU 14E1 and LDS 2000 dispensers are electrically synchronized to the dicing saws to dispense lubricants into saw DI water line. The lubricant flow is controlled by a digital pumping unit, which precisely dispenses the exact volume of lubricant material. The systems self-monitors and recalibrates automatically to maintain set dispensing volume of the lubricant.

  • AKLC400 Series | L300 D5CMOS_B
    AKLC400 and D5CMOS_B are perfect for slicing and cutting hard materials - Sapphire, GaN, SiC, Quartz glass and Electronic Package Singulation.<br />...

  • AKLC400 and D5CMOS_B are perfect for slicing and cutting hard materials - Sapphire, GaN, SiC, Quartz glass and Electronic Package Singulation.   AKLC400 and D5CMOS_B are revolutionary materials that offers excellent heat transfer, extends diamond wire and Blade life, improves wafer-die reliability and is extremely environmentally friendly.
  • FLC200 Series
    FLC200 electronic grade cleaning agent is uniquely designed to remove contaminants and residues on semiconductor wafer surfaces as well as the surface of other substrate materials – glass, PCB boards and clean<br />...

  • FLC200 electronic grade cleaning agent is uniquely designed to remove contaminants and residues on semiconductor wafer surfaces as well as the surface of other substrate materials – glass, PCB boards and clean

    It is specially formulated aqueous concentrate designed to dissolve and remove all types of fluxes left on parts after PCB-SMT soldering process. Flc200 penetrates isolated and tight-tolerance areas to quickly dissolve and remove non-ionic and ionic contaminants left on the non-component side of circuit boards. And like all our products, FLC200 is completely biodegradable

  • LWC600 Series
    LWC600 is designed to protect wafer surfaces while laser dicing/cutting semiconductor wafers. It has a unique feature that effectively prevents debris and residue from adhering/sticking to the wafer surface during wafer laser dicing process.<br />...

  • LWC600 Series Wafer Coating Material for Laser Dicing Application.

    LWC600 is designed to protect wafer surfaces while laser dicing/cutting semiconductor wafers. It has a unique feature that effectively prevents debris and residue from adhering/sticking to the wafer surface during wafer laser dicing process.

  • UDM L300-01- D5CMOS_C Series
    D5CMOS_C Series is used at an economically dilution ratio of 1:10000 – 1:15000. It is ideal for enhancing die-separation process to maximize yields and improve customer profitability....

  • D5CMOS_C Series is used at an economically dilution ratio of 1:10000 – 1:15000.  It is ideal for enhancing die-separation process to maximize yields and improve customer profitability. The UDM Systems® L-Series lubricants are specifically designed to reduce electrostatic buildup, dissipate heat, prevent galvanic corrosion and enhance lubrication, hence enabling sawdust dispersion and cleaner bonding pads. L-Series lubricants are biodegradable, non-corrosive aqueous solution and environmentally friendly.

  • Wafer Dicing Lubricants – L300 Series
    Our L300 Series Dicing Lubricants are ideal for enhancing die-separation process to maximize yields and improve customer profitability....

  • Our L300 Series Dicing Lubricants are ideal for enhancing die-separation process to maximize yields and improve customer profitability. The UDM Systems® L-Series lubricants are specifically designed to reduce electrostatic buildup, dissipate heat, prevent galvanic corrosion and enhance lubrication, hence enabling sawdust dispersion and cleaner bonding pads. L-Series lubricants are biodegradable, non-corrosive aqueous solution and completely DI (deionized) water-soluble.


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