Ultra-Pak Industries Co Ltd

New Taipei City, 
Taiwan
http://www.upak.com.tw
  • Booth: M0448
  • - 4th Floor

Founded in 1995, Ultra-Pak Industries Co., Ltd. is a manufacturer specializing in the research, development, production and sales of conductive materials. It is marketed globally under our brand name"U-PAK".
With a strong R&D team and a perfect vertical integration system from material, equipment, mold, and production process, therefore, we can meet customer's requirements with the best support and services. 


 Press Releases

  • (20200819)

 Products

  • Carrier Tape for IC and Electronic Components
    Application areas:<br />semiconductors, LEDs, connectors, transformers, passive components and special shaped parts can be used...

  • Standard Carrier Tape for IC:
    The customized carrier tape design and analog components meet the requirements of the EIA specification, and the most stable forming method is used to control the size so that the components are best protected in the design rules. Single-layer and multi-layer winding methods provide customers with more length options.

    Deep forming Carrier Tape: 
    Complex and deep molds are products that U-PAK has accumulated many years of design experience. The characteristics of carrier tapes are usually span angles, ribs, platforms, stop points, angles and special shapes. These designs allow components to be safely protected. U-PAK has a variety of process forming techniques to optimize the carrier tape with a width of 104mm and a depth of more than 25mm. 

  • Mini Tape for WLCSP
    Application field:<br />semiconductor WLCSP, Bare Die, LED Mini LED and very small parts can be used...

  • Mini Tape:
    Mini Tape is an innovative process developed that combines materials expertise and engineering technology to specifically target precision and tiny components. The forming size is controlled by the processing capacity close to zero tolerance and the minimum arc angle, and the super-optimal stability of the ratchet hole is used to minimize the shaking of the component in the carrier tape and achieve the best positioning effect of the device. Special patented design can prevent parts from slipping out of the pocket and reduce the chance of sticking crystals.

  • HAA Cover Tape
    The UP-175 and UP-176 series:...

  • The UP-175 series:
    UP-175 is a transparent heat-sealable tape with double-sided antistatic, uniform bonding and adhesion. It is suitable for packaging various electronic components. The adhesive formula has high stability. After sealing, it will not cause tape opening or sticking parts to cause the parts to fall.

    The UP-176 series:
    UP-176 is a transparent heat-sealable tape with double-sided antistatic, uniform bonding and adhesion. It is suitable for packaging various electronic components. The adhesive surface formula has high stability. After sealing, it will not cause tape opening or sticking parts to cause the parts to fall. The special antistatic formula on the rubber surface allows it to maintain antistatic properties even in a low humidity environment.

  • Plastic Reel
    Used to protect the carrier tape from damage during transportation and storage...

  • Style:
    2 in 1 plastic disc
    3 in 1 plastic disc
    Ultrasonic plastic disc
    7" plastic disc


    Material: HIPS
  • Conductive PS sheet & Protective band
    -...

  • Conductive PS sheet:
    For the production of conductive materials for carrier tape.
    Material: PS

    Protective band:
    Used on the entire carrier tape for extra and better protection.
    Material: PS

  • ACF(Anisotropic Conductive Film)
    -...

  • FOG(Film on Glass):ACF for bonding of FPC and LCD panel.
    FOB(Film on Board):ACF for bonding of FPC and PCB.
    FOF(Film on Film):ACF for bonding of FPC and ITO-PET.
    COG(Chip on Glass):ACF for bonding of driver IC and glass substrate.

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