Standard Carrier Tape for IC:
The customized carrier tape design and analog components meet the requirements of the EIA specification, and the most stable forming method is used to control the size so that the components are best protected in the design rules. Single-layer and multi-layer winding methods provide customers with more length options.
Deep forming Carrier Tape:
Complex and deep molds are products that U-PAK has accumulated many years of design experience. The characteristics of carrier tapes are usually span angles, ribs, platforms, stop points, angles and special shapes. These designs allow components to be safely protected. U-PAK has a variety of process forming techniques to optimize the carrier tape with a width of 104mm and a depth of more than 25mm.