Yamaha Motor Robotics Holdings Co., Ltd

Minato-ku,  Tokyo 
Japan
https://www.ymrh.co.jp/en/
  • Booth: M0234
  • - 4th Floor


"Connect the Future by Packaging Innovation"

To concentrate Japanese manufacturing capabilities into a new force, Yamaha Motor Robotics Holdings Co., Ltd. was newly born through a business integration among Yamaha Motor Co., Ltd., SHINKAWA LTD., APIC YAMADA CORPORATION and PFA Corporation 

We handle semiconductor back-end process of SHINKAWA, APIC YAMADA and PFA to provide a total solution that exceeds our customers’ expectation by our 1STOP SMART SOLUITON.

Yamaha Motor Robotics Holdings Group : Shinkawa Ltd, APIC YAMADA CORPORATION, PFA Corporation


 Products

  • APIC YAMADA - Mold & Separation -
    Manufacturing and sales of semiconductor manufacturing equipment such as molds and lead processing, dies and ultra-precision lead frame parts....

  • Compression mold / 壓縮成形模壓設備

        WCM-330
         WLP Molding System
         [WLP成型模壓系統]

        LPM-600
         Large Panel Compression molding system
         [大型基板壓縮成型模壓裝置]

        SCM-100G
         Strip compression molding system
         [基板壓縮成型模壓裝置]

    Transfer Mold / 注塑成型模壓設備

        GTM-X
         High performance molding system
         [高性能封裝模壓裝置]

        GTM-S
         Standard auto-molding system
         [標準封裝模壓裝置]

        GTM-170T
         Molding system for large scale module
         [適用於大模組的成型模壓系統]

    Trim & Form System / 切斷成形設備

        COMBO-300SW D/D
         Dambar and Dejunk System
         [D/D切斷成形裝置]

        COMBO-300SW T/F
         Trim & Form System
         [T/F切斷成形裝置]

  • Shinkawa - BONDER -
    Die Bonder, Wire Bonder, Flip Chip Bonder, etc. Manufacture and sale of semiconductor manufacturing equipment....

  • Die Bonder / 貼片機

        SPA-1000
         High-Accuracy Twin-Head Die Bonder
         [高精度雙機頭貼片機]

        STC-800
         Discrete Application Die Bonder
         [用於Discrete貼片機]

    Wire Bonder / 焊線機

        UTC-5000NeoCu Super
         High-speed wire bonder with new SimLoop function as standard capability
         [標準搭載新功能「SimLoop」的高速銅線焊線機]

        UTC-5000WE NeoCu
         UTC-5000NeoCu Super basis configuration with wider substrate capability (100mm width)
         [UTC-5000 NeoCu super 作為平台,可生產更寬幅度基板的機型(~100mm width)]

        UTC-5100
         High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability
         [可對應寬大框架、適用於生產LED、Discrete的高速焊線機]

    Bump Bonder / 植球機

        SBB-5200
         Wide Area Handling High-speed Wafer Bump Bonder
         [對應晶圓的工作區域寬的高速植球機]

    Flip Chip Bonder / 倒裝貼片機

        FPB-1 NeoForce
         Package Bonder for Multiple Processes
         [對應Multi process的靈活封裝貼片機]

        LFB-1102Super
         Flip Chip Bonder for TCB process
         [Substrate用TCB工藝的倒裝貼片機]

        LFB-2301
         Flip Chip Bonder for TCB process
         [Wafer用TCB工藝的倒裝貼片機]

        YSB55w
         High-Speed & High-Accuracy Flip Chip Bonder
         [高速・高精度倒裝貼片機]

  • PFA - Factory Automation -
    Assembling camera modules, crystal devices, flat panel displays, etc. Manufactures and sells various manufacturing equipment for mounting and inspection....

  • Camera Module Products / 相機模組製造設備

        HM-A200
         Active Alignment Bonder
         [全自動鏡頭搭載機]

        HM-A100D
         Active Alignment Bonder for dual cameras
         [雙攝像頭用全自動鏡頭搭載機]

        HM-50
         Lens Holder Mounter
         [模組搭載機]

    Crystal Devices / 石英裝置製造設備

        PBM-1100
         Blank Mounter
         [點膠機]

        PMI-21
         Mask Placer
         [排片機]

        PTTA-C5Z Ⅱ
         Temperature Characteristic Inspection Equipment
         [溫度特性測試設備]

        PLT-20
         Frequency Adjustment Equipment
         [頻率調整機]

    Flat Panel Display Products / FPD製造設備

        FPD-I1300
         Indentation Inspection Machine (AOI)
         [壓痕檢查設備(AOI)]

        FPD-IMS1400
         Automatic Optical Inspector for FPD bonding
         [壓痕檢查設備(AOI)]

  • YAMAHA MOTOR - SMT & FA Robots -
    SMT equipment, including mounters, printers, AOI, and, FA robots such as scara and linear conveyor....

  • SMT ASSEMBLY SYSTEM / 電子元件貼裝相關設備.貼片機

        YRM20
         Premium High-efficiency Modular
         [高端高效模塊貼片機]

        Z:LEX TSM20R/YSM20WR
         High-efficiency Modular
         [高效模塊貼片機]

        YSH20
         Hybrid Placer Intelligent Cubic
         [高速、高精度、倒裝晶片貼片機]

        YST15
         Intelligent SMD Storage System
         [智能SMD倉儲系統]

        YSP10
         Premium printer
         [高性能小型印刷機]

        YSD
         High-speed Dispenser
         [高速點膠機]

        YSi-SP
         3D Solder Paste Inspection Machine
         [3D高速錫膏印刷檢查機]

        Ysi-V
         High-end Hybrid optical inspection system (AOI)
         [高端混合型光學式外觀檢查裝置]

    Industrial robots / 工業機器人

        YK-X
         SCARA robots
         [水準多關節機器人]

        YA
         Articulated robots
         [垂直多關節6軸及7軸機器人]

        LCM
         Linear Conveyor Modules
         [線性傳送模組]

        TRANSERVO/FLIP-X//GX/YLE
         Single axis robots
         [單軸機器人]

        PHASER
         Linear motor single axis robots
         [線性馬達單軸機器人]

        XY-X
         Cartesian robots
         [直交機器人]

  • Taiwan R&D Lab
    <Heterogeneous Integration> We cope with various issues and challenges from development through manufacturing of semiconductor packaging. We strengthen our supportability for customers in Taiwan as a new focal point to connect with all of them....

  • ▶ New Taiwan R&D Laboratory

    ▶ Packaging Evaluation

    ▶ Location / Access

    ▶ Heterogeneous Integration

                                 ...Connect to the staff


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