Besi - Leading assembly equipment.
BE Semiconductor Industries N.V. (Besi) with its members Datacon, Esec, Fico, and Meco, is a leading manufacturer of flip chip and multi-chip die bonding, die attach (epoxy and soft solder), die sorting, wire bonding, packaging and plating equipment. Besi offers the most complete advanced packaging solution from die sorting to singulation – all from one source.
Zhubei City, Hsinchu County
Seoul, 06164 Korea