American Semiconductor is the industry leader in thin chip packaging.
America’s OSAT for design, packaging, assembly and test of state-of-the art thin electronics technology.
American Semiconductor Demonstrates SoP-HEMI™ Spherical CHIPS for Ocular and Image Sensor Applications
What We Do
We are the semiconductor manufacturing service provider that specializes in development and production of thin substrates, IC packaging and chip-on-flex assembly. American Semiconductor (ASI) thin-device capability is based on Semiconductor-on-Polymer™ packaging that makes the thinnest devices and semiconductor substrates possible. ASI is a global provider of a complete range of services for thin electronic system manufacturing. Our extensive expertise, capabilities, and facilities enable us to support your program requirements for new product development and volume manufacturing.
Services & Products
American Semiconductor’s advanced packaging technology and services provide thin capabilities. ASI’s offerings include Semiconductor-on-Polymer™ chip scale packaging, chip-on-flex assembly and a wide variety of engineering and design services. See List of Services & Products below.
Design & Prototyping
SoP Packaging
Assembly & Test
FleX-ICs
Development Kits
Wearables & Labels
Investors
Advanced Packaging is the future for semiconductor technology. American Semiconductor’s Semiconductor-on-Polymer™ (SoP) produces the thinnest packaged ICs possible and is a revolutionary process for protected Fan-In. SoP enables next generation, low cost, high reliability, ultra-thin integrated circuits that greatly improve the ability to integrate semiconductor functionality for thin PCB, Fan-Out, Heterogenous Integration and multi-chip advanced packaging. Interested in finding out more?