ECM Semco

  • Booth: I2305
  • - 1st Floor

Your SEMI Partner with Equipment + Process Expertise

ECM SEMCO is present in the semiconductor market since 1986 and has extensive experience in engineering and manufacturing of mass-production and labortory furnaces for atmospheric and reduced-pressure processing as well as wafer transport automation and software control. 

The company's field of competence covers diffusion, oxidation, LPCVD and PECVD. Typiocal applications include LYDOP POCL3 and BCl3 Diffusion, LYTOX Wet and Dry Oxidation, Anneal, Silicon Nitride, Silicon Oxinitride, Poly Silicon and TEOS. To address the challenges attached to scaling from lab scale R&D to pilot line and volume manufacturing, SEMCO ECM proposes the MINILAB platform, an offsite  process development and qualification tool covering the complete range of above-named applications. 

SEMCO's Electrostatic Chucks offers smart solutions for clamping and processing of thin and ultra-thin wafers based on its proprietary ESC capacitive technology. SEMCO has been designing and manufacturing electrostatic chucks (ESC) and heating pedestals to the wafer processing industry since 1992. SEMCO ECM provides leading OEMs, Semiconductor Fabs, foundries and laboratories worldwide with innovative and efficient wafer handling components as original equipment or retrofit. The company actively manages global support through our subsidiaries and service centers.

ECM SEMCO also specialized in the design and manufacture of mass flow controllers, precision valves and assemblies for the control of liquids and gases used in the fabrication of semiconductor, optical and PV materials.


    Batch type Tube Furnace, R&D & Small Prod Horizontal Furnace...

  • Batch type Tube Furnace

    Diffusion, LPCVD and Oxidation

    1 to 4 Independent Tubes

    Up to 300mm wafers

    Up to 50 wafers per tube

    Ideal for process engineering

    Tiny Footprint

    Manual or Automatic Loading

    Batch type PECVD System, R&D & Small Prod PECVD Platform...

  • Batch type PECVD System

    Direct Plasma, Low RF

    Pin Mark Free, Color Uniform

    Horizontal Wafer Process

    Up to 300mm wafers

    Up to 25 wafers per batch

    Multiple layers deposition possibilities

    In-situ Cleaning

    Mass Production Furnace / Batch type production Furnace...

  • Batch type production Furnace

    Diffusion, LPCVD and Oxidation

    Up to 4 Independent Tubes

    Up to 300mm wafers

    50 to 400 wafers per tube

    Best in-class Uniformity

    Automatic Loading

  • JETSTAR K7 to K7
    RTA / RTP Ideal for mass production...

  • High temperature infrared heating

    Si, SiC, GaN, Sapphire wafers

    Wafers up to 300mm

    Up to 1200°C

    Single or dual chambers

    Cassette to cassette automation

    High-temperature Oxidation Vertical Furnace / Batch type Oxidation Furnace...

  • SiC wafers oxidation

    Dry & wet oxidation

    High temperature resistive heating

    Up to 1600°C

    Up to 50 wafers 200mm

    Automatic loading

    High-temperature post-implant Annealing Vertical Furnace / Batch type Activation Furnace...

  • SiC, GaN wafers annealing

    Graphene growth

    Fast heating and cooling capability,

    Up to 2000°C

    Up to 50 wafers 200mm

    Automatic loading