Hsinchu County, Taiwan November 22, 2021 – Alliance Material as the innovator in adhesive materials. With the unique core technology, AMC is committed to creating cost-effective and eco-friendly products, used to provide customized solutions for advanced processes in diverse fields including semiconductors.
In recent years, AMC has actively developed semiconductor materials for back-end processes such as wafer back grinding, advanced packaging, die dicing, and so on. Today, we will officially announce it to the public, expect to bring the benefit for you.
- Wafer Backside Grinding Tape is multifunctional, with anti-warpage and chemical resistance properties, not only for general wafer thinning but the advanced process such as BGBM and DBG
- Balanced Film for warpage control through special lamination methods also could withstand high temperatures and harsh chemical reactions during the process
- Carrier Film is flexible, with four debonding ways to meet the different process demands. It could be applied in diverse fields and would not cause any residues
- EMI Shielding Film with excellent bump covering, which could replace the fixture of traditional backside metal process
For more detailed information or any other solutions, please feel free to contact us at any time. AMC Materials is looking forward to cooperating with you in the future, to explore the unique solution from a different perspective.
Alliance Material Co. Ltd
No.1, Aly. 15, Ln. 191, Zhonghe St. Zhubei City,
Hsinchu County 302047, Taiwan
Tel: 886-3-5550999 Fax: 886-3-5537640