CyberOptics Corporation Taiwan Branch

Nantun Dist.,  Taichung City 
Taiwan
https://www.CyberOptics.com
  • Booth: I3128
  • - 1st Floor


Welcome to meet us and see the demo of MRS 3D+2D sensor!

CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high-precision 3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor capital equipment markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the Company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

CyberOptics公司(www.cyberoptics.com)是高精度3D傳感技術解決方案的全球領先的開發製造商。CyberOptics感測器廣泛應用於表面黏著技術(SMT)和半導體領域的檢測和計量,大幅提高製程成品率和產能。CyberOptics憑藉其先進技術,確立了其在高精度3D感測器領域全球領導者的戰略地位,這也使公司進一步加大了向重點垂直市場的滲透力道。公司總部設在明尼蘇達州明尼阿波利斯,透過在北美、亞洲和歐洲的工廠與機構進行全球營運。


 Products

  • SQ3000™+ Multi-Function for 3D AOI, SPI & CMM
    THE ULTIMATE IN SPEED, RESOLUTION AND ACCURACY WITH MULTI-FUNCTION CAPABILITY FOR ADVANCED APPLICATIONS...

  • SQ3000+ Multi-Function System with Multi-Reflection Suppression™ (MRS™) sensor technology provides the ultimate combination of high resolution, high accuracy and high speed for inspection and metrology. It remains the only system on the market capable of performing AOI, SPI and CMM in-line.

    Ultra-High Resolution, 5 Micron - Multi-Reflection Suppression (MRS) Technology

    The SQ3000+ is powered by CyberOptics’ proprietary 3D sensing technology with sophisticated fusing algorithms that enables metrology grade accuracy at production speed. The result is ultra-high quality 3D images, high-speed inspection and metrology, and improved yields and processes.

    SQ3000+ offers unmatched accuracy with the advanced MRS sensor technology by meticulously identifying and rejecting reflection-based distortions caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for accurate measurements. The new, ultra-high resolution 5 micron MRS sensor incorporated into the SQ3000+ is specifically designed for advanced applications with the most demanding requirements.

    Inspection and Metrology Solution for Assembly and Process Improvement for Advanced Applications

    The SQ3000+ with MRS technology is ideal for high-end applications including advanced packaging, mini/micro LED, advanced SMT applications for automotive, medical, military, aerospace and advanced electronics, 008004/0201 solder paste inspection (SPI), socket metrology and other high-end coordinate measurement (CMM) applications where quality and reliability are critical.

    Intuitive, Easy-to-Use Software - Enable Smarter, Faster Inspection

    The multi-award winning SQ3000 AOI software is a more powerful yet extremely simple software suite designed with an intuitive interface and multi-touch control with 3D image visualization tools. Ultra-fast programming capabilities bring the ease-of-use to a completely new level and significantly speeds setup, simplifies the process, reduces training efforts and minimizes operator interaction – all saving time and cost.

    Speed programming and tuning with new capabilities including AutoTeach, AutoTune and AutoDefine for faster set-up and a simplified process. AI² (Autonomous Image Interpretation) technology is all about keeping it simple - no parameters to adjust or algorithms to tune. And, you don’t need to anticipate defects or pre-define variance either. AI² does it all for you, powered by a data-rich, pre-loaded library and automated scripts that collect and update models all on their own. With AI², you have the power to inspect the most comprehensive list of features and identify the widest variety of defects. AI² offers precise discrimination with just one panel inspection making it a perfect solution for high-mix and high-volume applications.

    Faster, Highly Accurate Coordinate Measurement (CMM) Suite

    CyberCMM™, a comprehensive software suite of coordinate measurement tools, provides highly accurate, 100% metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y to name a few. A fast and easy set-up can be performed with the world’s first in-line CMM system for programming complex applications as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments with traditional coordinate measurement machines (CMMs).

  • WX3000™ Metrology and Inspection Systems
    WX3000™ Metrology and Inspection Systems for Wafer-Level and Advanced Packaging...

  • WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression™ (MRS) Sensor Technology.

    Metrology-Grade Accuracy with MRS Technology

    Sub-micrometer accuracy for features as small as 25 μm. Accurately inspect shiny or mirror-like surfaces. Attain repeatable and reproducible measurements.

    Fast, Superior Inspection Performance

    Increase throughput with the MRS sensor that is 2-3X faster than alternate technologies, delivering greater than 25 wafers (300mm) per hour for 12" and 8" wafer sizes and 55 wafers per hour (200mm) for 6" and 8" wafer sizes. Attain 3D and 2D measurements in one pass versus multiple separate scans. Conduct 100% 3D and 2D metrology and inspection versus sampling-only methods.

    Versatility for Wafer-Level and Advanced Packaging Applications

    Measure and inspect a wide range of semiconductor applications including gold bumps, solder balls and bumps, wafer bumps, copper pillars and other wafer-level and advanced packaging applications. Measure and inspect critical packaging features including bump height, coplanarity, diameter and shape, relative location and variety of other measurements.

  • SQ3000 CMM for Semiconductor Applications
    THE ULTIMATE IN SPEED AND ACCURACY FOR COORDINATE MEASUREMENT APPLICATIONS - SECONDS. NOT HOURS...

  • SQ3000 CMM utilizes CyberCMM™, a comprehensive software suite of coordinate measurement tools that provides highly accurate, 100% metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y to name a few. A fast and easy set-up can be performed in less than an hour for programming complex applications as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments with traditional coordinate measurement machines (CMM).

    Fastest – Seconds, not Hours

    Significantly speeds attaining coordinate measurements vs. traditional CMMs. Reduces engineering resource time.

    Easy-to-use Interface

    Simplifies process with award-winning, intuitive, touch screen experience. Quick programming for complex applications. Multi-process capable – AOI, SPI, AOM, CMM

    Metrology-grade Accuracy

    Achieve metrology-grade accuracy with MRS-enabled technology. Repeatable and reproducible measurements for metrology, semiconductor, microelectronics and SMT applications.

  • MX3000™ 3D AOI
    THE ULTIMATE IN SPEED AND ACCURACY FOR MEMORY MODULE INSPECTION...

  • The MX3000™ is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS™ Sensors delivering simultaneous dual-sided automated final vision inspection for singulated memory modules – for metrology grade accuracy at production speed.

    The system provides in-line defect review stations and auto sorts false calls into good trays after review, is fully automation-ready, SECS/GEM and S2/S8 compliant.

    Multi-Reflection Suppression™ (MRS) Technology

    MX3000™ offers unmatched accuracy with the revolutionary MRS technology by meticulously identifying and rejecting reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurements making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.

    Flexibility At Its Best

    The MX3000™ 3D Automated Optical Inspection (AOI) system enables high resolution, dual-sided final vision inspection that doubles productivity. In-line multiple module grippers minimize handing tact time, and autoconversion supports various memory module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM and others.)

    Faster, Smarter Programming

    With ultra-fast programming capabilities, auto tuning and other enhancements, CyberOptics’ AOI software significantly speeds set-up, simplifies the process, reduces training efforts and minimizes operator interaction.

  • WaferSense® Wireless Measurement Devices
    Speed your semiconductor processes with WaferSense and ReticleSense measurement devices....

  • When you need the most efficient and effective measurement devices for semiconductor tool set-up and maintenance processes, count on CyberOptics, the global market leader in wireless semiconductor measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration, airborne particle, relative humidity and resistance measurement.

    Semiconductor fabs and OEMs value the accuracy, precision and versatility of the WaferSense and ReticleSense measurement portfolio to enable improvements in fab yields and equipment uptime.