XBS300 Temporary Bonder

The XBS300 supports all key process steps for temporary bonding: release layer formation, adhesive coating, low force wafer bonding, UV curing or thermal curing and cooling.

Thanks to its flexible configuration the XBS300 is able to process all commercially available temporary bonding adhesives.

(Please Contact SUSS for available bonding adhesive types)

Details for Substrates

+ 200 and 300 mm wafers

+ Oversized carriers with 201 or 301 mm in diameter

+ Various carrier materials (Silicon, Glass etc.)

Supported Bonding Technologies

To minimize the risks in thin wafer handling, the wafer is mounted on a carrier wafer prior to thinning.

Bonding is only to facilitate further processing – the bond is designed to be dissolved once the wafer is processed.

Process steps required for temporary wafer bonding

+ Application of release layers (coating or plasma deposition)

+ Adhesive coating

+ Bonding

+ Thermal or UV curing

SUSS MicroTec offers an open platform that is compatible with all common material systems used in temporary wafer bonding. In addition to the methods already used in production today, SUSS MicroTec is devoted to ongoing work towards qualifying new materials, in this way supporting the largest selection of adhesives currently available in the market.

Highlights

+ Open bonding platform supporting flexible configuration and all common adhesives and techniques

+ Coating of bonding and release layers, including temporary bonding, in one system

+ Integrated metrology to determine wafer thickness and TTV

XBC300 Gen2 Debonder & Cleaner

Mask Aligner

The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike. SUSS MicroTec designs their mask aligner systems for lithography applications in the field of 3D packaging, advanced packaging, MEMS, LED, compound semiconductors, power devices, photovoltaic, nanotechnology and wafer-level optics.

MA200Gen3

The MA200Gen3 offers intelligent solutions for a large range of process requirements for wafer size up to 200mm.

A high level of automation, e.g. with an optional automatic filter exchange unit, an optional UV-LED exposure system or an optional closed loop runout control functionality, shortens valuable process times, increases yield and significantly reduces cost of ownership.

Ease of use has played a major role in the design of the MA200Gen3. Features such as an adjustable monitor and an ergonomic I/O interface, a continuous-run loadport and direct view on the exposure stage make it comfortable to work with the MA200 Gen3 even under high work load.

MA300Gen3

The MA300 Gen3 is a member of the high end mask aligner family from SUSS MicroTec that are designed to address the requirements of modern high-end fabs in a high volume manufacturing environment.

The standard topside alignment with accuracies down to 0.5 µm (DirectAlign) the 3D dedicated alignment platform enables bottom side and infrared alignment for 300 mm based three-dimensional (3D) packaging lithography applications such as etch masks for TSVs and dicing streets, backside redistribution layers (RDLs) or bumping applications. While bottom-side alignment enables SUSS MicroTec 300 mm Mask Aligners to process double-sided structured wafers, the infrared alignment option allows the handling of opaque, yet IR-transparent materials such as adhesives, in particular for thin wafer handling or encapsulation applications.

MO Exposure Optics®

The telecentric illumination provided by MO Exposure Optics improves light uniformity and leads to a larger process window. Yield enhancements are produced as a result. MO Exposure Optics also decouples the exposure light from the lamp source, so small misalignments of the lamp do not affect light uniformity. A decoupled light source saves setup and maintenance time and guarantees uniform illumination conditions during the entire lifetime of the lamp.

• Excellent light uniformity over full exposure field
• Stable light source
• Customizable illumination by means of illumination filter plate exchange
• “Deep-UV-ready” process capabilities with fused silica micro-optics
• Auto-alignment is based on a motorized alignment stage. The COGNEX® based pattern recognition software automatically recognizes wafer target locations and controls the movement of the alignment stage. Coupled with SUSS MicroTec‘s DirectAlign®, accuracy to 0.5 μm can be achieved. Auto-alignment enables highest repeatability of process results coupled with optimized throughput and minimum operator intervention.

Imprint Lithography

SUSS MicroTec offers various approaches to the imprint technology, tailored to the specific process requirements of different applications. All imprint solutions are based on SUSS MicroTec’s highly regarded semi-automated mask aligner suite and support multiple substrate materials and sizes from small pieces up to 200 mm wafers.

The mask aligner platform not only allows for accurate alignment of stamp to substrate but also provides valuable functionalities such as precise stamp-to-substrate levelling and contact pressure control. Process recipes are conveniently edited, offering a high degree of adjustability for all relevant parameters. SUSS mask aligners already in the field are easily upgraded with imprint tooling.

SUSS Imprint Technologies

SUSS manual and semi-automated mask aligners are designed for maximum versatility. Fast and easy switching between all options and wafer/substrate sizes is at the core of SUSS MicroTec’s imprint technologies. Different options in one tool save clean room space as well as investment costs, thus providing a high degree of flexibility in process and device development.

SCIL (substrate conformal imprint lithography) technology is particularly suitable for high demand imprint processes.

• Full-area imprint up to 200 mm
• High resolution (< 70 nm)
• High alignment accuracy (± 1 µm)
• Long-life stamp

For the transfer of patterns in the micro- to nanometer range, SUSS MicroTec offers SMILE (SUSS MicroTec imprint lithography equipment) technology.

• Precise control over resist layer thickness and uniformity
• Structures on both wafer sides are possible
• Lens wafers stacking and UV bonding
• High alignment accuracy (+/- 1 µm)
• Edge handling or the application of buffer wafers to avoid active area contact
• Handling of warped wafers

The MA300 Gen3 is a member of the high end mask aligner family from SUSS MicroTec that are designed to address the requirements of modern high-end fabs in a high volume manufacturing environment.

In addition to the standard topside alignment with accuracies down to 0.5 µm (DirectAlign) the 3D dedicated alignment platform enables bottom side and infrared alignment for 300 mm based three-dimensional (3D) packaging lithography applications such as etch masks for TSVs and dicing streets, backside redistribution layers (RDLs) or bumping applications. While bottom-side alignment enables SUSS MicroTec 300 mm Mask Aligners to process double-sided structured wafers, the infrared alignment option allows the handling of opaque, yet IR-transparent materials such as adhesives, in particular for thin wafer handling or encapsulation applications.

Unlike steppers proximity mask aligners are very efficient when exposing very thick layers. Mask aligners offer large process windows because they don't have the depth of focus limitations known from projection systems.

Top-Side Alignment (TSA)

Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, micro-bumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on the substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as with the DirectAlign® system invented by SUSS MicroTec.

Highlights

• Mask aligner for the highest level of alignment precision
• Clear and stable pattern recognition even under poor contrast conditions

A mask with a certain structure is aligned with the wafer in very close proximity (thus “proximity” lithography). During exposure, the shadow cast by the mask structure is transferred to the wafer. The resulting exposure quality depends on both the precision with which the mask and wafer are spaced apart and the optical system used for exposure.
Being fast and suited to flexible implementation, this method is regarded as the most cost-effective technique for producing microstructures down to 3 µm in size. With contact exposure, resolutions in the sub-micron range can be achieved. Typical areas of use include wafer-level chip-scale packaging, flip chip packaging, bumping, MEMS, LED and power devices. The systems are deployed in high-volume production, as well as in industrial research.
The mask aligners supplied by SUSS MicroTec are based on proximity lithography.

Highlights

• Superior resolution as a result of diffraction-reducing optics
• Process stability through the use of microlens optical systems

MO Exposure Optics®

is a unique illumination optics system specifically designed for SUSS mask aligners. It is based on microlens plates instead of macroscopic lens assemblies. A simple plug and play changeover allows a quick and easy changeover between different angular settings, including the functionality of both classical SUSS HR (High Resolution) and LGO (Large-Gap Optics) illumination optics.
The telecentric illumination provided by MO Exposure Optics improves light uniformity and leads to a larger process window. Yield enhancements are produced as a result. MO Exposure Optics also decouples the exposure light from the lamp source, so small misalignments of the lamp do not affect light uniformity. A decoupled light source saves setup and maintenance time and guarantees uniform illumination conditions during the entire lifetime of the lamp.

Highlights

• Excellent light uniformity over full exposure field
• Stable light source
• Customizable illumination by means of illumination filter plate exchange
• “Deep-UV-ready” process capabilities with fused silica micro-optics
• Auto-alignment is based on a motorized alignment stage. The COGNEX® based pattern recognition software automatically recognizes wafer target locations and controls the movement of the alignment stage. Coupled with SUSS MicroTec‘s DirectAlign®, accuracy to 0.5 μm can be achieved. Auto-alignment enables highest repeatability of process results coupled with optimized throughput and minimum operator intervention.

The flexible DSC300 Gen3 Bridge-Tool for 200 mm and 300 mm wafers is re-engineered for higher performance and minimized overhead time. The DSC300 Gen3 Scanner delivers a 300 mm wafer throughput of more than 90 wph at 400 mJ/cm² and >80 wph at 1000 mJ/cm² dose.

Its enhanced 1X Wynne-Dyson optics and four recipe-selectable numerical apertures (NA’s) enable the achievement of fine 2 μm features in thin resist, as well as >100 µm DoF in thick resist. The full-field imaging technology of the DSC300 Gen3 supports industry roadmaps for large die patterning and mixed die packaging for heterogeneous integration. In addition, fan-out wafer-level packaging applications can benefit from its optical die-shift compensation option. This latest die-shift and run-in/run-out mitigation feature corrects for up to ± 200 ppm (30 µm on a 300 mm diameter wafer).

With the projection scanner DSC300 Gen3, SUSS MicroTec offers a complementary technology to its mask aligner portfolio and a lowest cost of ownership alternative for traditional projection stepper lithography.

The Alternative to 1X Steppers

Traditional 1X stepper lithography tools waste an excessive amount of time to ramp up stage speed, decelerate stage speed, then stop and settle. Multiply that wasted time for 50~70 shots and the resulting throughput is rather low.

Comparatively, the DSC300 Gen3 is exceptionally fast with its proprietary smooth, continuous serpentine scanning technique – no stops to waste time. The highly uniform beam with its well controlled projection area insures that the features all the way out at the edges of the wafer get the same uniform dose as the inner wafer. In addition, the beam overlaps itself by 50% on each scan pass to further average the dose across the entire wafer.

Prior to each scan exposure, the system measures the UV intensity and controls the stage velocity to provide the intended UV dose programmed into the recipe. The scanned light uniformity across the entire wafer is ≥ 97% (≤ 3% non-uniformity).

Features & Benefits

• Uses easy to design full-field masks (non-inverted)
• Best pattern and position replication
• Superior technique for large-die and heterogeneous integration
• No step-field size limitations – no stitching
• Fast exposure times with good uniformity

High Throughput

The DSC300 Gen3 Projection Scanner elevates 1X projection lithography throughput to new heights – achieving triple digit levels for low doses (more than 90 wph for 300 mm wafers). An additional advantage to the DSC300 Gen3 is that the high throughput is stable for a specific UV dose no matter the pattern die size or wafer layout. Further, wafer edge exposure (WEE) and wafer edge protection (WEP) are handled by the full-field mask pattern and take no additional time.

• Drastically higher throughput compared to 1X steppers
• Throughput is not die-size, field-size or pattern dependent

XBS300 Hybrid Bonding Platform

The universal XBS300 platform is designed for (hybrid) fusion bonding of aligned 200 mm and 300 mm wafers. Its highly modular design offers maximum configuration flexibility at low cost-of-ownership for customers. Different configurations are available to meet the requirements in both R&D and high-volume manufacturing (HVM) environments. The new XBS300 hybrid bonding platform allows for both collective D2W (die-to-wafer) and W2W (wafer-to-wafer) hybrid bonding focusing on most demanding applications such as 3D stacked memory or 3D SOC (system-on-chip).

Highlights

Industry leading < 100nm (3-Sigma) overlay 

Closed-loop feedback between integrated metrology and bond aligner

High-performance integrated metrology

Reflective IR option

Compatible with silicon or glass carriers