Jipal Corporation

Hsin Chu, 
  • Booth: N0176
  • - 4th Floor

Welcome to Jipal booth M 0348 (4F) !!!

JIPAL CORPORATION is a professional agent for Semiconductor Packaging / LED/Solar/ SMT equipment and materials and providing after -sales and technical service support.


Allteq:Die Coater & Post W/B Inspection.

Aurigin:Advanced Solder Ball Placement.

Asahi: Auto Transfer Molding System,

Capable: Professional Mold Chase / kit.

Furukawa:UV Tape for Dicing, Grinding & BGA Singulation, Die Attach flim Adhesives DAF &FOW.

Fasford:LOC/BOC Die Bonder.

GSP: Fully Auto Jig Saw Singulation System. 

Hitachi (Tohken) : X-ray Inspection System.

Hitachi (Aimechatec) : Ball Printing System.

Hover-Davis: The feeder expert, Tape & Reel Feeder, Label Feeder.

IKK: New Module Trim/Form System.

KLA-Tencor: Wafer Inspection, Component Defect Inspection. 

Kinergy:QFN buffing Machine.

MKE: Bonding Wire. 

Okamoto:Wafer Back Grinder & Polisher. 

Orion : High Through-put TCB Bonder. 

PAL:Ni/Au copper plating line for BGA Substrate.

Teikoku:Wafer Mounter & Taper/Detaper.

UBCT: Factory Automation Solution Provider.