Joen Lih Machinery Co., Ltd.

Tantzu dist.,, Taichung City
Taiwan
http://www.joenlih.com.tw

Booth: J2351
- 1st Floor

~ Joen Lih Customizes High Precision Surface Grinder at Your Request ~

Joen Lih Machinery Co., Ltd. is a leading manufacturer of surface and grinding machines in Taiwan. Our high precision wafer grinding machines, JL-200SCG & JL-300SCG, are top choice for grinding and processing of semiconductor and solar industry.

* SEMICON Highlight: Joen Lih introduces our JL-200SCG, JL-300SCG

* Products: Wafer Surface Grinding Machine, Micro-grooving Machine, High Precision CNC Profile Grinding Machine,
High Precision Surface Grinding Machine

Press Releases

(20210615)

(20210615)

(20210622)

JL-300SCGII : High Precision Wafer Surface Grinding Machine (20210720)

1. JL-300SCG II is used in grinding 8-inch to 12-inch wafers. It is specially produced for hard and brittle materials, such as reclaimed wafers, silicon wafers, silicon carbide, sapphire, ceramics and composite materials.

2. JL-300SCGII uses high-rigid aerostatics spindle which features in high cleanliness, high speed, long service life, low noise and low vibration.

3. The spindle has special designs of a built-in motor and central coolant through function. The spindle rotational accuracy can achieve 0.1 micro.

4. Both aerostatic spindle and ceramic vacuum suction worktable have central coolant through design, so you don't need to worry about the overheat problem.

5. Longitudinal Z-axis feeding resolution can reach to 0.1µm to achieve extremely accurate positioning and grinding.

6. While grinding 12 inch of wafers, JL-300SCGII can grind 50µm of thickness. The grinding accuracy is 3µm, and the surface roughness of wafers can reach to 0.012µm.

JL-52CNC-LM SURFACE & PROFILE GRINDING MACHINE (20210720)

JL-52CNC-LM is a newly developed CNC surface and profile grinding machine by JOEN LIH MACHINERY.
The vertical and cross feed movements are by CNC, and the longitudinal movement is driven by linear motor, which makes the processing efficiency faster than traditional surface grinder. For longitudinal movement, the table speed can reach 36M in one minute. Also, since the linear motor has less contact with mechanism, it owns higher dynamic reflection, longer stability and better positioning precision compared with ball screw.

The JL-52CNC-LM is suitable for grinding different shapes of punches and processing that requires high efficiency and accuracy.

Products

JL-300SCGII 晶圓減薄研磨機

高精密晶瓷加工機。專為研磨加工硬脆材料打造，包括再生晶圓、矽晶圓、碳化矽、藍寶石、陶瓷和複合材料。減薄矽晶圓最薄可達50µm。12吋晶圓研磨精度達 3µm，加工表面粗糙度達0.012µm!!... More Info Less Info

1. 高剛性氣靜壓主軸: 具有高潔淨, 高轉速、長壽命、低噪音及低振動等優點。

2.主軸迴轉精度可達0.1µm，具中央出水功能

3.採用陶瓷工作台面可真空吸附、中央出水及自我研磨確保最佳幾何度

4. 採縱向(Z軸)進給，解析度小於0.1µm。精準定位研磨，

5. 減薄矽晶圓最薄可達50µm。12吋晶圓研磨精度達 3µm，加工表面粗糙度達0.012µm!!

JL-50400CNC 線軌專用成型磨床

線軌三面成型研磨機，可研磨15型以上滑軌! 可選擇搭配三大品牌控制器 (Fanuc / Siemens / Syntec)... More Info Less Info

機型：JL-50400CNC 機械規格 頁次：1/1

項目		單位	尺寸/數值
加工範圍	工作台面積	mm	400 x 4100
	最大研磨面機	mm	400 x 4875
	磁盤面積	mm	80 x 4080
	工作台載重	Kgs	2000
	T溝	mm	14 x 2 x 350
	磁盤面治工作檯面距離	mm	385
	雙主軸開距	mm	最小. 315 ~ 最大. 675
	砂輪上面至工作檯面距離		最小. 355 ~ 最大. 480
	砂輪下緣至工作檯面距離		最小. 0 ~ 最大. 390
雙主軸	伺服馬達	Kw	20/ 27.5
	主軸轉速	Rpm	1260 ~ 2270
	砂輪尺寸(外徑寬度內徑)	mm	ψ510 x 50 xψ203.2
X軸左右進給	行程	mm	5500
	油壓馬達	mm	40 (6 kw)
	左右移動速度	m/min	3~25 (油壓) 0~30 (伺服馬達)
	軌道		雙V 軌道貼耐磨片+鏟花 (油壓系統) 線性滑軌 (滾珠螺桿系統)
Y軸前後進給	行程	mm	180
	滾珠螺桿	mm	ψ40
	伺服馬達	Kw	2.85
	減速比		齒形皮帶輪減速
	移動速度	m/min	3.3
	最小設定單位	mm	0.001
	軌道		線性滑軌
Z軸上下進給	行程	mm	125
	滾珠螺桿	mm	ψ40
	伺服馬達	KW	2.85
	減速比		行星式齒輪減速機
	移動速度	m/min	0.33
	最小設定單位	mm	0.001
	軌道		線性滑軌
砂輪修整器	鑽石滾輪尺寸	mm	ψ102 x 最大. 80 x ψ50.8
	最高轉速	rpm	6000
	伺服馬達	Kw	1.57
	減速比		齒形皮帶輪減速
臥式副主軸	馬達	*HPP**	10 x 4
	主軸轉速	rpm	3200 ~ 1570
	砂輪尺寸	mm	ψ405 x 50 x ψ127
臥式副軸Y軸前後進給	行程	mm	440
	滾珠螺桿	mm	ψ40
	伺服馬達	Kw	1.57
	減速比		Coupling
	移動速度	m/ min	20
	最小設定單位	mm	0.001
	軌道		線性滑軌
臥式副軸Z軸上下進給	行程		410
	滾珠螺桿	mm	ψ40
	伺服馬達	mm	1.57
	減速比	Kw	行星式齒輪減速機
	移動速度		0.5
	最小設定單位	m/ min	0.001
	軌道	mm	線性滑軌
尺寸	機器尺寸	mm	14485 x 2610 x 2890
尺寸	佔地空間	mm	14880 x 4263 x 2890
電流	裝箱尺寸	mm	10900 x 2610 x 2890
重量	機器重量	Kgs	28400
重量	裝箱重量	Kgs	32000

JL-100VG 立式迴轉磨床

適合長形、圓筒型工件的研磨加工!! 旋轉工作台直徑: Φ1050 mm，工作台乘載重量可達: 1200 KGS，加工範圍從Φ50 mm ~ Φ1250 mm!! 可依照加工廠需求採用電磁盤、夾爪及自動模具來固定工件，不需要依賴夾持治具夾持力。長型工件也不會有自重下垂和圓筒度不佳的問題，不會使工件變形或傷害工件表面!! 立式磨床的配置不會產生軸向軌道粉塵的問題，因其進給軸在加工區之上，加工粉塵不會堆積在軸向軌道上，延長機台使用壽命!!... More Info Less Info

機型：JL-100VG 機械規格頁次： 1/1

項目		單位	尺寸/數值
旋轉工作台	工件內徑研磨尺寸	mm	ψ50~ψ950
	工件外徑研磨尺寸	mm	~ψ1250
	工件安裝高度(含夾具)	mm	600
	內徑研磨最大長度	mm	325 (內徑小於∮250) 500 (內徑大於∮250)
	外徑研磨最大長度	mm	500
	工作台最大載重	KG	1200
	工作台直徑	mm	ψ1050
	移動轉速	rpm	10~80
砂輪	轉速	rpm	線速度<33M/S
	內研磨砂輪尺寸 (*外徑寬度內徑)*	mm	ψ100x50xψ50.8
	外研磨砂輪尺寸 (*外徑寬度內徑)*	mm	ψ305x75xψ127
X軸左右進給	行程	mm	1800
	滾珠螺桿(直徑*螺距)	mm	ψ50x16
	移動速度	m/min	24
	最小設定單位	mm	0.0001
	軌道		線性滑軌
Z軸上下進給	行程	mm	700
	滾珠螺桿(直徑*螺距)	mm	ψ50x10
	移動速度	m/min	12
	最小設定單位	mm	0.0001
	軌道		鋼軌
頭部	頭部傾角	度(°)	22.5°
馬達	主軸馬達	KW	20(內藏式)
	X軸伺服馬達	KW	4.5
	Z軸伺服馬達	KW	5.5
	旋轉工作台伺服馬達	KW	11
刀庫	刀具數量		6
刀庫	刀把型式		HSKA100
電流	總額定電流(約)	A
重量	機器重量	Kg	約18000
重量	裝箱	Kg
空間	*佔地面積(長寬)**	mm	4400x4100

JL-52CNC-LM線馬平面磨床

JL-52CNC-LM為準力新開發之線馬平面磨床~ 搭配線性馬達使加工效率比傳統磨床更快!!... More Info Less Info

JL-52CNC-LM為準力新開發之線馬平面磨床~ 搭配線性馬達使加工效率比傳統磨床更快!!

JL-300SCG High Precision Wafer Surface Grinder

Specially made for wafers of hard and brittle materials, like reclaimed wafers, silicon wafers, silicon carbide, sapphire, ceramics and composite materials. The machine ensures extraordinary grinding accuracy with surface roughness of wafers to 0.012µm.... More Info Less Info

1. JL-300SCG II is used in grinding 8-inch to 12-inch wafers. It is specially produced for hard and brittle materials, such as reclaimed wafers, silicon wafers, silicon carbide, sapphire, ceramics and composite materials.

2. JL-300SCGII uses high-rigid aerostatics spindle which features in high cleanliness, high speed, long service life, low noise and low vibration.

3. The spindle has special designs of a built-in motor and central coolant through function. The spindle rotational accuracy can achieve 0.1 micro.

4. Both aerostatic spindle and ceramic vacuum suction worktable have central coolant through design, so you don't need to worry about the overheat problem.

5. Longitudinal Z-axis feeding resolution can reach to 0.1µm to achieve extremely accurate positioning and grinding.

6. While grinding 12 inch of wafers, JL-300SCGII can grind 50µm of thickness. The grinding accuracy is 3µm, and the surface roughness of wafers can reach to 0.012µm.

Joen Lih Machinery Co., Ltd.

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