Premtek International Inc.

Hsinchu, 
Taiwan
http://www.premtek.com.tw
  • Booth: N0276
  • - 4th Floor

Welcome to PREMTEK

Premtek International Inc., founded in 1988, is a professional sales and service distributor of equipments and consumables for semiconductor, OPTO and PCB industries in Greater China. With it''s positioning as an integrated service provider,Premtek aims at adding value to its customer&vandors. For servicing our broad range of customers, we currently have offices in Hsinchu, Kaohsiung, Shanghai, Shenzen,..etc. Our main products include:Premtek(CQT)- 2”~12” Fully Auto Dual-Chambers RTP Systems; EPM-General Purpose & High Speed Memory Bench Tester; HANMI-Total Solution for Back-End Assembly House; STI-2D/3D IC Inspection, Wafer Sorting,Taping System &Test Handler; S50 Versatile SOC tester; Nordson MARCH-Plasma Cleaner, Plasma Etcher, R.I.E System; Asymtek-High Speed Automatic Dispensing System; Xandex-Chip Probe/ Wafer Test Disposable Electric/ Pneumatic Ink Cartridge

Categories

101 Photovoltaic Device Manufacturing
  • PV: Cells
    • 200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Ball Placement; Attach Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Deflashing; Degating Tools
  • Device Handling; Feeding Systems
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lead Frame Taping Systems
  • Marking; Imprinting; Labeling Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Package Handling; Conveying Equipment
  • Printing Equipment; Screen-printing; Alignment ; Film Printing
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • Package Inspection; Lead Scanners
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 204 Equipment, Mems
  • Deep RIE etching; Dry Etching
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology Tools
    • 206 PV Equipment
  • Cells
    • 207 Equipment, Process
  • Bumping Systems
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Etching; Stripping; Ashing - Dry and Wet Equipment
    • 208 Equipment, Test
  • Burn-In Accessory Systems
  • Discrete Component Test Systems
  • Failure Analysis Systems
  • FPD Test; Measurement; Repair Equipment
  • Handlers; Positioner Systems
  • Linear Test Systems
  • Logic Test Systems
  • Memory Test Systems
  • Package Test Systems
  • Printed Circuit Board; Wire Board (PCB or PWB) Test and Repair
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
  • System on a Chip (SOC); Mixed Signal Test Systems
    • 300 Materials, Assembly
  • Marking ink
  • Molding; Encapsulation; Potting; Resin Materials
    • 502 Material Handling Systems
  • Conveying; Material Handling Systems
  • Robotics; Transfer Systems
    • 700 Manufacturing Services
  • Deposition Service
  • Etch; Strip; Cleaning Service
    • 701 Manufacturing Services or Consulting
  • Manufacturing Process Support and Development
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