Rokko Electronics Co., Ltd.

Hyogo,  Japan 
  • Booth: M1039
  • - 4th Floor

We specialize in wafer processing operations.

We, Rokko electronics Co.Ltd. take the following roles in the semiconductor production process.

1:Wafer grinding & polishing.(normal / thin / ultra thin for Silicon, SiC , LT , LN , Sapphire)

2: Wafer reclaim.

3:Wafer Cleaning

4:Special wafer processing for SiC ,Sapphire , LT  & MEMS applications.

 We provide the thin/mirror finished surface required for sensor or power device applications through its integrated  grinding & polishing process.4 to 8 inch wafers can be processed with the finished thickness of 15 to 100 μm in both test and volume productions.Besides the integrated processing services,we are also capable of meeting special processing needs such as grinding-finish(#8000)and polishing -only services.

  Quality is the 1st priority in our operations.All parameters are measured and monitored,which includes thickness accuracy,polishing precision to give customers the best available quality and services.