Jipal Corporation

Features:

• Wafer grinding wheels perform a stable high removal rate, longer lifetime and lower/consistent grinding resistance during processing.

Application:

     For thinning process of

•  TSV package wafers (Cu/compound).
•  SiC, sapphire, Si and reclaimed wafers.
•  MEMS/LED, diode etc.

Specification:

Features:

• High-performance,  High-precision,  Uniform suction force.
• Partial chucking without sagging.
• Chucking and transport of wafer without leaving suction marks.
• Produces no static electricity and dust.
• Reusable (after rework)

Application:

• High precision porous vaccum chucks are suitable and can be tailored for grinding,   cleaning, dicing and measuring processes of semiconductor wafers etc. upon customers' request

Specification:

Dressing board is used to get a better cutting quality and throughput of dicing blade in IC Assembly front end-Wafer saw process. Dicing blade can be newly pre-shaped and re-sharpened via dressing board to stabilize processing, and to minimize the chipping of as-cut die edge.

Features:

• Dressing board, with flatness to firmly suction on chuck table larger than 80Kpa, can efficiently remove clogging and glazing of dicing blade with less consumption.

 Application:

• Dressing board is used to pre-shape a new dicing blade by trimming its uneven edge and to expose diamond grits on its edge for cutting.
• Dressing board is used to re-sharpen a dicing blade by interval dressing to restore and maintain the stable cutting ability during processing.

Specification: