Beijing Doublink Solders Co., Ltd.

Beijing,  chaoyang 
  • Booth: N0967
  • - 4th Floor

The Doublink company always make customers more satisfied!

Beijing Doublink Solders Co. ltd, a national high-tech enterprise registered i n Zhongguancun Science Park’sis member of China''s IC packaging and testing industry chain technology innovation alliance and Zhongguancun semiconductor lighting industrial technology alliance. The company was established in 1999 December.

    Our company''s main products are gold bonding wirecopper bonding wire and Silver bonding wire for integrated circuits, semiconductor devices and LED package. It also produces wire and sector of gold and gold alloy for deposition.

   Doublink company, with a number of patents and independent intellectual property rights, focused on R&D and production of bonding wire on electronic packaging, and has the ability to develop new products. In 2009, the company undertook the major national 02 program of “R & D and industrialization of bonding wire for advanced packaging ”, now has been successfully completed and the product of the project can completely replace the imported products.

The company has three complete bonding wire production lines, including gold bonding wire production line, copper bonding wire production line and silver bonding wire production line. Production and detection equipments reached the international advanced level, we can provide above 300000000 meters of gold bonding wire, 100000000 meters of copper bonding wire and 100000000 meters of silver bonding wire.

   The company has passed TS16949, ISO14001 environmental management system certification and QC080000 hazardous substance process control management system certification. In the future, we will adhere to strict management, continuous improvement and constantly innovation, accurately and effectively provide high quality, stable quality of products and services for the majority of customers, make better contribution for the development of electronic packaging industry.