Alliance Material Co., Ltd.

Cool Release (Optical Grade)

With excellent optical properties, cool release film suit for flexible film sensor and process protection. The adhesive strength could be changed by decreasing the temperature.

Features:

• High-Temperature Resistant :

100℃~140℃for short time

• Chemical Resistance :

Resist acid (aqua regia), alkali (KOH), and etching chemicals

• Easily Peel:

          Cooling (<5°C), for no residue, removing

Thermal Release

AMC thermal release tape could be designed based on process temperature, applied in the CSP process, and other carrier processes.  

Features:

• Chemical Resistance
• Diversified Design
• Cost-effective
• Easily Peel

UV Release

With high adhesion, would not cause scatter or shift during dicing and could reduce viscosity via UV light. UV release tape is used for the dicing and carrier process in glass, LED, and semiconductor fields.

Features:

• Displacement/Rupture Prevention
• Low Energy Viscosity Reduction
• Wide Applicability
• Cost-effective

Laser Release

The liquid solution has a flexible application property, suit for colorless film sensors process and other applications.

Features:

• Chemical Resistance
• Heat Resistance
• Thin Coating

Probe cards are an indispensable item in the semiconductor testing field. However, after a period of probing, the particles, dirt, and carbon sediment will deposit on the probe pins. To maintain the testing quality, the clean sheet plays an important role, but the abrasion issues came out.

With different technology, AMC clean pads do not contain any abrasive particles. We adopt adhesive coating to remove the sediments from the probe pin, suitable for any probe pin type, especially crown type. In addition, it is not only available in the chip probing process, but in final test solutions, could match with a variety of socket dimensions.

Features:

• Practically without abrasion
• Needle shape protection
• High flexible structure
• Cost-effective

To achieve high efficiency, cost reduction, and wearable devices, IC packaging processes are gradually going towards advanced wafer-level and stack packaging, which caused the warpage issue to become serious increasingly.

The most common solution for warpage is equipment transformation, but time-consuming, costly, and high uncertain. Based on material properties, AMC developed a better solution, a balanced film.

It could control the warpage in all directions arbitrarily and peel easily without any residue to protect the adherend.

Features:

• Warpage Control
• Thermal Stability
• Chemical Resistance
• Wide Applicability

Wafer back grinding has been an indispensable semiconductors process for enhancing IC performances such as improving processor speed and decreasing power consumption. In the past decade, due to the development of wearable devices and stacked packages, the demand for ultra-thin wafers is rapidly increasing.

In addition, with the strict requirement of wafer quality and yield rate, there are lots of advanced processed be adapted such as Backside Grinding Backside Metal (BGBM), Dicing Before Grinding (DBG), and Stealth Dicing Before Grinding (SDBG).

However, no matter what kinds of processes, there all face the wafer warpage challenge, therefore, AMC delivers the new multifunctional back grinding tape that could against warpage and chemicals, to make the process run smoothly and effectively.

Features:

• Excellent TTV
• Chemical Resistant
• Low Contamination

Owing to improve the heat dissipation of high-power IC, the backside metal packaging technology has been developed. During the process, it is important to protect the surface of BGA Solder balls. In traditional, fixtures are the most common solution, but it costs time and money.

However, AMC EMI shielding film adopted the thin PET as the backing, to enhance the coverage and make solder balls full protection. Moreover, the black ink is printed on it to block the light so that the solder balls obviously could be checked if it is covered. That is the best solution for cost reduction and a user-friendly.

Features:

• Fixture Free
• Without Residue
• Good Bump Covering