Over the past 30 years, based on the beneficial comparation, division of labor and specialization in global supply chain, which allows the continued innovative development worldwide in Semiconductor industry. With this architecture, the US is committed to the range of IC design and sales, Japan and Netherlands are dedicated in IC materials and equipment while Taiwan, South Korea, and China are focus on production and manufacture. In order to enhance the competition in Taiwan, the Grintimate is dedicated in developing high-precision, high-quality, low vibration, environmentally machine tools to keep up with the growing of semiconductor industry for a wide range of processing requirement. At the moment, the global semiconductor industry competition has been turning white-hot situation, apart from production processing, yield rate, or production capacity, and the newly use of material is critical. The material revolution caused by the third generation of semiconductor industry, which is mainly with GaN and SiC materials. In order to provide a wide range of materials in grinding application, with the exclusive hydrostatic spindle technology, which could enhance the stability and rigidity of machine, providing the optimized processing equipment for clients.
The most important core technology of Grintimate is with the exclusive hydrostatic spindle technology, all the products are equipped with a hydrostatic spindle. In order to widely applied in the gradually growing industries for high-precision processing, such as semiconductor, electric automobile, automation intelligence, and aerospace industries, etc. The wheel spindle of plunge type cylindrical grinder (CDC-series) and angular type cylindrical grinder (CAC-series) features high-rigidity, high vibration resistance, high load-capacity, and temperature rise resistance, the spindle run-out can easily reach < 1.0μm, perfectly on heavy cutting efficiency and mirror surface performance. The CAC series has excellent precision not only on O.D. surface, taper surface, forming O.D. surface, R surface, grooved surface, and end-face surface, but also be widely used in target and Sapphire crystal column grinding.