Jipal Corporation

Hsin Chu, 
Taiwan
http://www.jipal.com
  • Booth: N0176
  • - 4th Floor

Welcome to Jipal,

   Jipal Corporation

  • We are an engineering services company.
  • Jipal was established in June 1990, dedicated for SEMICON Back End Packaging Equipment, Material selling, and full coverage of technical consult and product service support.
  • Territory started from Taiwan, extended to China and SEA, over 20 locations of Jipal offices among of Asia.

Our Principals

  • AEMULUS
  • AIMECHATEC
  • ALLTEQ
  • AMESS
  • ASAP
  • ASAHI
  • Aurigin
  • CAPABLE
  • centrotherm
  • EMAGE
  • FURUKAWA ELECTRIC
  • FASFORD TECHNOLOGY
  • GSP
  • MARS TOHKEN (Hitachi High-Tech)
  • HOVER-DAVIS
  • IKK
  • INTELUME
  • ITW EAE
  • KINIK
  • KINERGY
  • KLA
  • KOBAYASHI & CO., LTD
  • Legend
  • MKE
  • NIPPON KAYAKU
  • Okamoto Machine Tool Works. LTD.
  • ORION SYSTEMS INTEGRATION
  • PAL
  • TEIKOKU
  • UBCT

   Jipal always back you up!



 Products

  • Fully Auto Jig Saw Singulation; Gravita 36
    Genuine Solutions (GSP) produces and markets our proprietary flagship Gravita Jig Sawing System, integrated with Disco world class DFD dicing engine, to worldwide semiconductor companies. <br />...

  • Main Features:
    • Hi-speed Productivity : 36,000 (Dry-run), 24,000 (Actual run)
    • 300x100 Strip capability, 1.3x1.3 picker capability
    • High warpage handling 5HP vacuum pump, 379.94 mm2 piping area
    • Strip In Strip Out Lead Frame Half-Cut/Isolation process
    • Strip in strip out for high warpage/alignment o strip
    • Dual Saw-Chuck table DFD6750 and Dual Package Drying & Cleaning system
    • Livebug/Deadbug Flipping Option after Sawing process
    • High-precision control & movement by Linear motor
    • 2 x 8 Individual pickers with auto Rotation for Unit Orientation and Placement Accuracy
    • Universal type Vacuum Picker design
    • 2D code and Strip mapping traceability up to Tray
    • Unloading Option : JEDEC Tray / Tube / Canister / Bulk and TNR
    Other Options:
    • Centralised UI for Dicer and Handler
    • Package side Brush-cleaning / 5 Side Vision / 3D Inspection for BGA
    • Inline Integration to Laser QFN Pre-cut and Laser marking
  • Wafer Grinding Wheels [晶圓研磨砂輪]
    Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers which consists of rough and fine grinding ones. Wafer grinding wheels are made of diamond abrasives and customized vitrified bond in a unique porous microstructure....

  • Features:

    • Wafer grinding wheels perform a stable high removal rate, longer lifetime and lower/consistent grinding resistance during processing.

    Application:

         For thinning process of

    •  TSV package wafers (Cu/compound).
    •  SiC, sapphire, Si and reclaimed wafers.
    •  MEMS/LED, diode etc.

    Specification:

    Material Wheel spec.
    • Pure Compound (EMC)
    • Compound + Silicon chip
    • Compound + Copper via
    Z1 #800 + Z2 #4000
    SiC wafer Z1 #2000 + Z2 #6000

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