CoreFlow Ltd.

Daliyat El-Carmel, 
  • Booth: L0928
  • - 4th Floor

CoreFlow, Innovative Areomechanical Solution for Semi & FPD

CoreFlow develops, manufactures, and markets advanced handling and conveying solutions, for Flat Panel Display (FPD) and Semiconductor equipment manufacturers. With more than 800 installations worldwide, CoreFlow’s air floating solutions can be found in the production floors of many top FPD manufacturing fab plants, where they reliably handle the glass panels of the leading display manufacturers. 

CoreFlow’s non-contact air floating solutions transport glass substrates of any size, thickness, and weight (including the latest G10.5 and 0.1 mm), between and within process systems with the utmost air-gap accuracy.

CoreFlow innovative aeromechanical solutions address the challenges of reducing backside contamination and handling warped wafers, for various applications within the Semiconductor process, and other industries. 

CoreFlow brings several decades of combined aeromechanical expertise to deliver manufacturing solutions with unmatched quality, accuracy, and stability – solutions that minimize your risk and maximize your manufacturing yield and throughput.

CoreFlow’s headquarters and research facility is based in Israel, with sales representatives located in Korea, Japan, Taiwan, China, and Germany.


  • Non-Contact Solutions
    Non Contact Chuck solution, for eliminating Wafer Backside Contamination...

  • The requirements for faster, energy-efficient, and more compact computers drive the industry for smaller semiconductor devices, sometimes even smaller than what Moore’s law had predicted. This ever-decreasing structure size requires a particle-free production environment. A single particle at the size of 0.5 microns (that is 1/500 of a human hair thickness) may cause device failure. While traditional handling methods ensure wafer front (active) side cleanliness, they usually have disgraced the issue of backside contamination.

    Recent processes have changed that and backside contact has become an inhibitor. Altering the wafer orientations (top and bottom) between nowadays processes causes contamination. 

      By eliminating mechanical contact with the wafer, CoreFlow’s non-contact chuck practically keeps the process particle-free!

    The counteracting pressure and vacuum forces keep the wafer flying at a precise height of about 30 microns. The forces flatten the wafer which enables precise inspection or/and metrology applications. Particle generation and metal contamination risks are eliminated altogether.

    Key Features and Benefits

    • Reduction of particles by a factor of 300 or more!
    • Elimination of metal contamination.
    • Thermal and mechanical vibration separation.
    • Adjustable flattening forces for warped and/or thin wafers.
    • Available for 150 (6”), 200, and 300 mm standard thick and thin wafers.
    • Typical applications are inspection, metrology, lithography, etc..