CyberOptics Corporation Taiwan Branch

SQ3000+ Multi-Function System with Multi-Reflection Suppression™ (MRS™) sensor technology provides the ultimate combination of high resolution, high accuracy and high speed for inspection and metrology. It remains the only system on the market capable of performing AOI, SPI and CMM in-line.

Ultra-High Resolution, 5 Micron - Multi-Reflection Suppression (MRS) Technology

The SQ3000+ is powered by CyberOptics’ proprietary 3D sensing technology with sophisticated fusing algorithms that enables metrology grade accuracy at production speed. The result is ultra-high quality 3D images, high-speed inspection and metrology, and improved yields and processes.

SQ3000+ offers unmatched accuracy with the advanced MRS sensor technology by meticulously identifying and rejecting reflection-based distortions caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for accurate measurements. The new, ultra-high resolution 5 micron MRS sensor incorporated into the SQ3000+ is specifically designed for advanced applications with the most demanding requirements.

Inspection and Metrology Solution for Assembly and Process Improvement for Advanced Applications

The SQ3000+ with MRS technology is ideal for high-end applications including advanced packaging, mini/micro LED, advanced SMT applications for automotive, medical, military, aerospace and advanced electronics, 008004/0201 solder paste inspection (SPI), socket metrology and other high-end coordinate measurement (CMM) applications where quality and reliability are critical.

Intuitive, Easy-to-Use Software - Enable Smarter, Faster Inspection

The multi-award winning SQ3000 AOI software is a more powerful yet extremely simple software suite designed with an intuitive interface and multi-touch control with 3D image visualization tools. Ultra-fast programming capabilities bring the ease-of-use to a completely new level and significantly speeds setup, simplifies the process, reduces training efforts and minimizes operator interaction – all saving time and cost.

Speed programming and tuning with new capabilities including AutoTeach, AutoTune and AutoDefine for faster set-up and a simplified process. AI² (Autonomous Image Interpretation) technology is all about keeping it simple - no parameters to adjust or algorithms to tune. And, you don’t need to anticipate defects or pre-define variance either. AI² does it all for you, powered by a data-rich, pre-loaded library and automated scripts that collect and update models all on their own. With AI², you have the power to inspect the most comprehensive list of features and identify the widest variety of defects. AI² offers precise discrimination with just one panel inspection making it a perfect solution for high-mix and high-volume applications.

Faster, Highly Accurate Coordinate Measurement (CMM) Suite

CyberCMM™, a comprehensive software suite of coordinate measurement tools, provides highly accurate, 100% metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y to name a few. A fast and easy set-up can be performed with the world’s first in-line CMM system for programming complex applications as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments with traditional coordinate measurement machines (CMMs).

WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression™ (MRS) Sensor Technology.

Metrology-Grade Accuracy with MRS Technology

Sub-micrometer accuracy for features as small as 25 μm. Accurately inspect shiny or mirror-like surfaces. Attain repeatable and reproducible measurements.

Fast, Superior Inspection Performance

Increase throughput with the MRS sensor that is 2-3X faster than alternate technologies, delivering greater than 25 wafers (300mm) per hour for 12" and 8" wafer sizes and 55 wafers per hour (200mm) for 6" and 8" wafer sizes. Attain 3D and 2D measurements in one pass versus multiple separate scans. Conduct 100% 3D and 2D metrology and inspection versus sampling-only methods.

Versatility for Wafer-Level and Advanced Packaging Applications

Measure and inspect a wide range of semiconductor applications including gold bumps, solder balls and bumps, wafer bumps, copper pillars and other wafer-level and advanced packaging applications. Measure and inspect critical packaging features including bump height, coplanarity, diameter and shape, relative location and variety of other measurements.

SQ3000 CMM utilizes CyberCMM™, a comprehensive software suite of coordinate measurement tools that provides highly accurate, 100% metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y to name a few. A fast and easy set-up can be performed in less than an hour for programming complex applications as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments with traditional coordinate measurement machines (CMM).

Fastest – Seconds, not Hours

Significantly speeds attaining coordinate measurements vs. traditional CMMs. Reduces engineering resource time.

Easy-to-use Interface

Simplifies process with award-winning, intuitive, touch screen experience. Quick programming for complex applications. Multi-process capable – AOI, SPI, AOM, CMM

Metrology-grade Accuracy

Achieve metrology-grade accuracy with MRS-enabled technology. Repeatable and reproducible measurements for metrology, semiconductor, microelectronics and SMT applications.

The MX3000™ is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS™ Sensors delivering simultaneous dual-sided automated final vision inspection for singulated memory modules – for metrology grade accuracy at production speed.

The system provides in-line defect review stations and auto sorts false calls into good trays after review, is fully automation-ready, SECS/GEM and S2/S8 compliant.

Multi-Reflection Suppression™ (MRS) Technology

MX3000™ offers unmatched accuracy with the revolutionary MRS technology by meticulously identifying and rejecting reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurements making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.

Flexibility At Its Best

The MX3000™ 3D Automated Optical Inspection (AOI) system enables high resolution, dual-sided final vision inspection that doubles productivity. In-line multiple module grippers minimize handing tact time, and autoconversion supports various memory module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM and others.)

Faster, Smarter Programming

With ultra-fast programming capabilities, auto tuning and other enhancements, CyberOptics’ AOI software significantly speeds set-up, simplifies the process, reduces training efforts and minimizes operator interaction.

When you need the most efficient and effective measurement devices for semiconductor tool set-up and maintenance processes, count on CyberOptics, the global market leader in wireless semiconductor measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration, airborne particle, relative humidity and resistance measurement.

Semiconductor fabs and OEMs value the accuracy, precision and versatility of the WaferSense and ReticleSense measurement portfolio to enable improvements in fab yields and equipment uptime.

PX3000™ The Ultimate in Speed and Accuracy

High Precision Accuracy with Multi-Reflection Suppression™ (MRS™) Sensor Technology

The PX3000 is powered by CyberOptics' breakthrough 3D sensing technology comprised of two MRS Sensors for semiconductor advanced packaging inspection and metrology. PX3000 offers unmatched accuracy powered by the revolutionary MRS technology by meticulously identifying and rejecting reflection-based distortions caused by shiny components and surfaces.

Effective suppression of multiple reflections is critical for accurate measurement, making MRS an ideal technology solution for a wide range of advanced packaging inspection and metrology applications including QFP, TSOP, BGA, and SMD.