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Your SEMI Partner with Equipment + Process Expertise
ECM SEMCO is present in the semiconductor market since 1986 and has extensive experience in engineering and manufacturing of mass-production and labortory furnaces for atmospheric and reduced-pressure processing as well as wafer transport automation and software control.
The company's field of competence covers diffusion, oxidation, LPCVD and PECVD. Typiocal applications include LYDOP POCL3 and BCl3 Diffusion, LYTOX Wet and Dry Oxidation, Anneal, Silicon Nitride, Silicon Oxinitride, Poly Silicon and TEOS. To address the challenges attached to scaling from lab scale R&D to pilot line and volume manufacturing, SEMCO ECM proposes the MINILAB platform, an offsite process development and qualification tool covering the complete range of above-named applications.
SEMCO's Electrostatic Chucks offers smart solutions for clamping and processing of thin and ultra-thin wafers based on its proprietary ESC capacitive technology. SEMCO has been designing and manufacturing electrostatic chucks (ESC) and heating pedestals to the wafer processing industry since 1992. SEMCO ECM provides leading OEMs, Semiconductor Fabs, foundries and laboratories worldwide with innovative and efficient wafer handling components as original equipment or retrofit. The company actively manages global support through our subsidiaries and service centers.
ECM SEMCO also specialized in the design and manufacture of mass flow controllers, precision valves and assemblies for the control of liquids and gases used in the fabrication of semiconductor, optical and PV materials.
Batch type Tube Furnace
Diffusion, LPCVD and Oxidation
1 to 4 Independent Tubes
Up to 300mm wafers
Up to 50 wafers per tube
Ideal for process engineering
Tiny Footprint
Manual or Automatic Loading
Batch type PECVD System
Direct Plasma, Low RF
Pin Mark Free, Color Uniform
Horizontal Wafer Process
Up to 25 wafers per batch
Multiple layers deposition possibilities
In-situ Cleaning
Batch type production Furnace
Up to 4 Independent Tubes
50 to 400 wafers per tube
Best in-class Uniformity
Automatic Loading
High temperature infrared heating
Si, SiC, GaN, Sapphire wafers
Wafers up to 300mm
Up to 1200°C
Single or dual chambers
Cassette to cassette automation
SiC wafers oxidation
Dry & wet oxidation
High temperature resistive heating
Up to 1600°C
Up to 50 wafers 200mm
Automatic loading
SiC, GaN wafers annealing
Graphene growth
Fast heating and cooling capability,
Up to 2000°C