• Booth: I2516
  • - 1st Floor

Corning Precision Glass Solutions provides glass-based solutions for emerging applications in microelectronics. We are a one-stop shop for glass wafers and panels, plus supporting solutions including automated laser-cutting, best-in-class metrology, coatings, and optical design expertise. Our products support a wide range of customer applications including Wafer-Level Optics, Carriers for Fan-Out Packaging, and Augmented Reality. We leverage Corning’s more-than 165 years of materials science expertise and proprietary manufacturing platforms to deliver rapidly customized solutions to our customers. Learn more about us at www.corning.com/precision-glass-solutions


  • Corning® EAGLE XG® Development Kits
    Corning® Eagle XG® Glass, Corning's industry-leading display glass, is available as development kits and can be purchased in several sizes and thicknesses....

  • Custom Glass Solutions specializes in providing customers with made-to-order, display-grade glass in custom sizes and quantities, suitable for a wide variety of applications.

    Corning® EAGLE XG® Glass enables display panel manufacturers to produce thinner, lighter, and more environmentally friendly displays. Our new Corning® EAGLE XG® Development Kits offer customers access to Corning’s industry-leading display glass in small quantities. Products are offered in several sizes and thicknesses with 10, 20, or 50 pieces available per kit.

    Visit our website to learn more. 

  • Augmented Reality Solutions
    Corning delivers high-index glass ranging from 1.7 index and above available in 150mm, 200mm, and 300mm sized wafers for augmented reality applications....

  • Corning provides leading glass-based solutions for cutting-edge augmented/mixed (AR/MR) reality devices. In addition to offering high index glass wafers, we also offfer world-leading flatness measurements systems from  Corning Tropel® Metrology Instruments and automated laser-glass cutting systems from Corning Laser Technologies. 

    Let's work together to help bring your augmented/mixed reality design ideas to life. 

  • Carrier Solutions
    We offer ultra-flat glass carriers available in a wide range of CTEs from 3.4 - 9.5 with available sizes in 150mm, 200mm. and 300m....

  • Corning provides high precision glass carriers for temporary bonding in advanced semiconductor packaging processes such as silicon wafer thinning and fan-out level processing. Our ultra-flat glass carriers have superior surface quality, thickness, and edge strength, making them the substrate of choice for advanced packaging.

    Learn more about Corning's Carrier Solutions

  • Wafer-Level Optic Solutions
    We offer multiple glass and ceramic compositions, various coatings, bonding and structuring<br />techniques, and world-class measurements to provide our customers with optimized solutions for wafer-level optic applications....

  • Corning has a suite of optical glasses ideal for sensing applications, including a range of material compositions optimized for CTE, refractive index, and dielectric properties. These optical glass wafers are used to make micro-optic components for sensing applications, including refractive and diffractive optical elements, lightguides, meta lenses, IR and UV filters, and more.

    From Corning® HPFS® Fused Silica to fusion-drawn optical glasses, we have a variety of materials with tightly controlled geometric tolerances to meet demanding customer requirements for wafer-level optic applications.

    Read what makes Corning an ideal supplier of glass for sensing technologies. 

  • Our Supporting Capabilities
    Corning Laser Technologies and Corning® Varioptic® Lenses help uniquely position Corning to help customers deliver increasingly demanding functionality and form factor requirements for consumer devices and the Internet of Things applications....

  • Trends for higher speeds, miniaturization, and interconnectivity are all driving the increased use of glass in many electronics applications. Corning has been working for nearly a decade to deliver customer focused innovation aimed at improving attributes of glass, in its various formats, to make it an attractive solution for next generation semiconductor packaging.

    Corning® Varioptic® Lenses can be adapted and modeled to support a variety of applications through electrowetting and lens structure. Additionally, Corning Laser Technologies offers innovative laser glass cutting and drilling technologies that have the ability to cut and drill 2D and 3D-shaped glass.