CXsemi Company Limited

We can upgrade your microscope (OM) and integrate AI to create an ADI/AEI automatic machine,
which can reduce manpower and (human) error

整合Horiba探頭，不僅膜厚涵蓋範圍廣(1nm~30um)，亦可解析多層膜並得到其N,K參數，因應5G、車用、通訊的半導體新材料，我司亦可客製化符合客戶的需求。

針對晶圓的翹曲，可透過輪廓儀以一片8秒的時間擷取晶圓上每個位置的高度值，獲得該晶圓的翹曲值(Bow/Warp)，可取代FSM所使用的雷射掃描，是一台效率極高的量測設備。

In the production process of semiconductor and optoelectronic factories, the machine functions are not intelligent enough.

The product cannot be stopped immediately so that the damage is reduced, when an abnormality occurs.

We provide transformation services such as image inspection, and we assist in the development of plug-in detection functions.

Without affecting the settings of the original machine, it will have an effective smart manufacturing function.

Main application

1. WET Bench equipment, unexplained wafer broken inspection

2. Unexplained wafer or robotic arm shift inspection

We use simple vision solutions and accurate detection software.

In addition to successfully assisting customers to save manpower, we also save a lot of man-hours and raw material costs.

Believe, we will be the best visual inspection consultant for you.