ITW EAE

Smarter, Faster and Highly Versatile

The Prodigy™ dispenser is designed and built to deliver high-speed, extremely accurate dispensing. A state-of-the-art XY gantry system is the heart of the system. A rigid frame design and advanced linear drive enables fast point to point moves, high accuracy and long term repeatable performance.

NuJet™ is a new jetting technology for the Prodigy that eliminates the use of a needle and incorporates a state-of-the-art pneumatic actuator that generates an operating frequency of up to 300Hz.  

Dynamic Dual Head™ (DDH) offers the unique ability to double dispense speed while maintaining the highest level of accuracy for both dispense pumps. The patented design corrects for part to part rotation in “real-time” allowing synchronous dispensing of both pumps. 
New IR Temperature Sensors measure in “real time” the top-side board temperature. Closed-loop control maintains the product within the specified temperature range ensuring process stability and increasing yields for underfill applications.

Camalot will provide a sneak peek at an Advanced Tilt and Rotate dispensing solution. This innovative and new Camalot design reduces wet out areas and improves capillary flow for underfill and provides access to dispense on side walls underneath or around tall components. Packaged into the Prodigy™ system the proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility. 

更智能，更快速和更多複合功能

Prodigy™ 點膠機專為高速、極其精準的點膠而設計和打造。最先進的XY軸驅動系統是系統的核心。堅固的剛性框架設計融合了先進的線性驅動結構使點到點的移動更加迅速、高精準和長期的可重複性。

NuJet™ 是 Prodigy 的一種新型噴射技術，它不需要使用針頭，採用最先進的氣動裝置，速度頻率最高達300Hz。

Dynamic Dual Head™ (DDH) 動態雙頭點膠具有獨特的雙倍點膠速度，同時雙點膠泵保持最高精準度。已獲專利的設計可以“實時”校準，不管部件間如何旋轉，實現兩個點膠泵同步點膠。

新的紅外溫度傳感器可以“實時”測量頂部電路板溫度。閉環控制使產品保持在指定的溫度範圍內，確保工藝穩定並提高底部填充應用良率。

Camalot 將讓您搶先一睹先進的傾斜和環繞點膠解決方案。這種最新的 Camalot 創新設計減少了沾黏區域，改善底部填充的毛細現象流動，並且能接近高大零組件下方或周圍側面進行點膠。 Prodigy™系統裡專有的運動和控制，允許點膠閥在兩軸上按照您需求，任意次數以小角度增加的方式旋轉到合適的位置，換句話說，實現完全的靈活。

Designed for semiconductor yield improvement.

The MPM® Edison™ meets the challenge of component miniaturization in the semiconductor market with proven print process capability greater than 2 Cpk for 0201 metric components.

• ±8μ @ 6 sigma alignment repeatability (≥2 Cpk)
• Optimal coplanarity: Ultra-tight coplanarity between stencil and substrate
• No print deviation: Single load-cell closed-loop squeegee-force control eliminates front-to-back variation and maintains set force across the entire board surface
• Highly effective stencil wiping: Patented paper tension control
• Contamination free print area: separate wiping and printing zone prevents cross contamination
• Secured thin substrate for consistent print quality: Venturi adjustable vacuum system
• Consistent printing quality and stencil protection: Large, flat blade-landing zone
• Minimized changeover: Super-size 5-inch (12.7cm) diameter paper roll
• Adaptable down to 18-inch stencil: Adjustable stencil shelf and adapter
• Small footprint: Compact design
• Industry 4.0 connectivity: OpenApps for customizable MES interface

MPM will be presenting live demonstrations of the Edison II ACT™ (Automatic Changeover Technology) which is in the final stage of development. This innovative patent pending technology provides a simple, cost-effective solution that can be implemented in progressive stages towards full automation. It is designed to be easy to use and simple to adopt and requires no additional skills to operate. The solution utilizes an Edison printer and a cost effective pairing cart designed to automate the changeover of solder paste cartridges, support tooling, squeegees, and stencils. 

專為提高半導體良率而設計。

MPM® Edison™ 可滿足半導體市場中元件小型化的挑戰，經過驗證的印刷工藝能力大於 2 Cpk，適用於0201公制元件。

• ±8μ @ 6σ 對準重複精度 (≥2 Cpk)
• 最優化的共面性: 創新的機器設計使模板和基材之間實現超緊密的共面性
• 沒有印刷偏差: 閉環壓力控制的單個高精度測壓傳感器消除了壓力前後變化，整張電路板表面的設定壓力保持不變
• 高效率鋼網擦拭: 已獲專利的擦拭紙張力控制
• 印刷區無污染: 擦拭區與印刷區隔離以避免交叉污染
• 確保薄基板印刷質量始終如一: 文丘里可調真空系統
• 始終如一的印刷質量和鋼網保護： 大平面刮刀著陸區域
• 更少更換: 超長 65 米擦拭紙捲
• 小到 18 英寸的模板適用: 可調鋼板架和連接器
• 佔地面積小：設計緊湊
• 工業 4.0 追溯: OpenApps 可定制的 MES 通信界面

MPM 將現場演示 Edison II ACT™ (自動轉換技術), 該技術正處於研發的最後階段。這項正在申請專利的創新技術提供了一個簡單、高性價比的解決方案, 以逐步實現完全自動化。它的設計簡單易用和操作方便, 無需額外的操作技能。該解決方案採用 Edison 印刷機和高性價比的配對推車, 旨在自動轉換錫膏筒、支撐工具、刮刀和模板。

Meeting the most critical and demanding semiconductor reflow requirements.

With an efficient heat transfer design, Centurion has a low energy consumption rate. Its reliable and robust design, backed by over 20 years of experience and capability, ensures high uptime even with the toughest reflow requirements. The patented CATHOX™ (Catalytic Thermal Oxidizer) dramatically reduces maintenance requirements while keeping a clean process environment that is critical for Semiconductor processing. 

Tight, closed-loop process control including closed-loop temperature controlled water cooling enables semiconductor customers to control cooling zones just like heating zones and meets the special cooling rate requirements for the industry. 

Nitrogen atmosphere is used to reduce oxidation of surfaces and minimize voids in the interfaces. Centurion’s chamber design in Nitrogen systems prevents air from getting into the process. It also comes standard with a quick purge system. Optional closed-loop PPM control automatically regulates oxygen levels. Nitrogen recirculation in the Flux Management System significantly reduces nitrogen consumption.

The Centurion offers smart software solutions that provide traceability, performance verification and enhanced efficiency. The new "idle mode" reduces power and nitrogen consumption when the machine is idle, reducing power consumption by up to 35% and nitrogen by up to 40%.

業內一流的熱性能和穩定性， 滿足最關鍵和最苛刻的半導體迴流焊需求。

高效率的熱傳導設計使 Centurion 具有較低能耗。可靠而穩定的設計來源於我們 20 多年的 SMT 經驗和能力，即使在最苛刻的工藝製程要求下，Centurion 仍能確保穩定正常運行時間。

擁有專利技術的 CATHOX™ (助焊劑催化分解系統) 極大地減少了維護保養要求，同時能保持對於半導體工藝至關重要的乾淨的製程環境。

Centurion 特有嚴密的閉環製程控制，包括閉迴路溫度控制水冷卻。這使半導體用戶能夠像控制加熱區一樣控製冷卻區，並滿足半導體業特定的冷卻速率要求。

使用氮氣來減少表面的氧化並且將虛焊最小化。 Centurion 的氮氣爐的爐膛設計防止空氣從兩端進入，並配有快速充氮系統。可選的閉迴路氧含量控制可自動調節氧氣含量。助焊劑管理系統中的氮氣再循環能顯著減少氮氣消耗。

Centurion 提供了智能軟件解決方案，具有可追溯性，性能驗證和效率提升。新的 “待機模式” 能在機器待機時減少多達 35% 的耗電量和多達 40% 的耗氮量。

Electrovert cleaning equipment plays a critical role in semiconductor fabrication and are utilized in multiple steps, including degreasing, cleaning prior to electroplating and underfill, cleaning after bumping and wire bonding, and carrier debonding of fan-out packages.  

Cleaning helps to remove flux residue, excess adhesive, grease and oils to ensure proper bonding and material distribution and avoid defects and increase yields. Electrovert cleaners are designed to deal with small, lightweight semiconductor products such as lead frames, BGAs, wafers and 3D stacked packages.

The Aquastorm™ delivers a small spray-jet mist that is less than 40 PSI. It delivers a dynamic combination of chemistry, thermal, and mechanical forms of energy at the surface to effectively clean under low stand-off and difficult to clean components. Integrated into the machine cabinet, the Torrid Zone™ delivers a controlled dynamic process that effectively removes moisture. Typical performance includes drying complex assemblies to within 0.1 gram of prewashed dry weight. The technology reduces exhaust requirements by 44% and uses 15% less power than conventional drying systems

The MicroCel™ cleaner uses centrifugal energy for unparalleled penetration, solubilization and containment removal for advanced packages including flip chips, MCMs, SIPs, BGAs, CSPs, and hybrid electronics. 

Electrovert 清洗設備在半導體製造中起著至關重要的作用，並且用於多個步驟，包括脫脂，電鍍和底部填充之前的清洗，倒裝焊和引線鍵合以及扇出封裝的載體剝離之後的清洗。

清洗有助於去除殘留助焊劑、多餘的粘合劑、油脂和油，以確保適當的結合和材料分佈，避免缺陷並提高良率。 Electrovert 清洗機旨在處理小型，輕巧的半導體產品，例如導線架，BGA，晶圓和 3D 堆疊封裝。

Aquastorm™ 提供的噴射霧小於 40 PSI。它在清洗表面提供了化學，熱和機械形式能量的動態組合，可以在較低的支撐距離和難以清潔的組件下進行有效清洗。

灼熱烘乾區整合在機櫃中，提供受控的動態過程，有效去除水分。典型性能包括將複雜組件乾燥至清洗前乾重量的 0.1 克之內。與傳統的干燥系統相比，該技術將排風需求減少了 44% 並且耗電量減少 15%。

MicroCel™ 清洗機利用離心能，具有無與倫比的滲透，溶解和密封消除，適用高級封裝，包括覆晶，MCM，SIP，BGA，CSP 和混合電子產品。

Despatch ovens have superior temperature uniformity of ± 0.5% of setpoint and offer SEMI S2/S8, CE, and SECS/GEM communication. Low particulate environmental controls protect from contamination and low oxygen levels prevent oxidation. Despatch ovens are used for adhesive bonding and curing, encapsulant curing, underfill curing of CMOS optical sensors, die attach and BGA, B-stage adhesive curing, polyimide curing, metallic thin film annealing, and photoresist curing.

The Despatch PCO2-14™ electrically heated oven was designed to meet the specific process requirements for hard baking polyimide coatings in an inert atmosphere. This high-performance, clean process oven (ISO Class 5/Class 100 recirculated airflow) offers many unique components, including a pressure relief system, an oxygen control system and a process monitoring system which allows the oven to achieve the strict oxygen level and atmospheric requirements involved in polyimide curing.

Despatch 烘箱具有出色的溫度均勻性，可達到設定值的 ± 0.5%，並提供 SEMI S2/S8, CE 認證標準和 SECS/GEM 通信。低微粒環境控制可防止污染，低氧水平可防止氧化。 Despatch 烘箱用於粘合劑粘合和固化，密封劑固化，CMOS 光學傳感器的底部填充固化，晶片貼裝和 BGA，B-stage 粘合劑固化，聚酰亞胺固化，金屬薄膜退火和光阻劑固化。

Despatch PCO2-14™ 電加熱烘箱的設計是為了滿足惰性氣體下硬烘烤聚酰亞胺塗層的特定工藝要求。這款高性能，潔淨工藝烘箱 (ISO 5 級/ 100 級再循環氣流) 提供許多獨特的組件，包括排壓系統，氧氣控制系統和工藝監控系統，使烘箱能夠達到聚酰亞胺固化時嚴格的氧氣水平和大氣要求。