The XBC300 Gen2 offers a range of module options specifically designed for debonding and cleaning applications.
The separation of the carrier from the device wafer is carried out well controlled with minimum stress on the device wafer by either mechanical peel-off or excimer laser-assisted debonding.
The peel-off debond process is compatible with the largest choice of adhesives and release layers for mechanical debonding. The laser-assisted debond process is based on UV laser technology and light-transmissive carriers such as glass or sapphire. Cleaning functionalities comprise tape mounted thin wafer cleaning with tape protection and carrier cleaning with integrated backside rinse.
The configuration flexibility of XBC300 Gen2 supports low volume process development as well as high volume manufacturing. The modular cluster design, featuring Dock and Lock™ technology, easily allows upgrading additional process modules in the field in order to extend functionality or increase throughput for moving into volume production. The XBC300 Gen2 offers both, low cost of ownership and process flexibility with full automation.
The XBC300 Gen2 is the complementary equipment to the XBS300, SUSS MicroTec’s platform for temporary wafer bonding.
The equipment prepares device wafers for wafer thinning and subsequent back side processing by bonding them to a carrier.