Joen Lih Machinery Co., Ltd.

Tantzu dist.,,  Taichung City 
Taiwan
http://www.joenlih.com.tw
  • Booth: J2351
  • - 1st Floor


YOU CAN ALWAYS CUSTOMIZE YOUR GRINDERS FROM JOEN LIH.

Joen Lih Machinery Co., Ltd. is a leading manufacturer of surface and grinding machines used for semiconductor and solar industry. SEMICON Highlight: Joen Lih introduces our JL-200SCG, JL-300SCG, or JL-2720MGM Products: * Wafer Surface Grinding Machine * Micro-grooving Machine * High Precision CNC Profile Grinding Machine * High Precision Surface Grinding Machine


 Press Releases

  • (20210615)
  • (20210615)
  • (20210622)
  • 1. JL-300SCG II is used in grinding 8-inch to 12-inch wafers. It is specially produced for hard and brittle materials, such as reclaimed wafers, silicon wafers, silicon carbide, sapphire, ceramics and composite materials.  

    2. JL-300SCGII uses high-rigid aerostatics spindle which features in high cleanliness, high speed, long service life, low noise and low vibration. 

    3. The spindle has special designs of a built-in motor and central coolant through function. The spindle rotational accuracy can achieve 0.1 micro. 

    4. Both aerostatic spindle and ceramic vacuum suction worktable have central coolant through design, so you don't need to worry about the overheat problem. 

    5. Longitudinal Z-axis feeding resolution can reach to 0.1µm to achieve extremely accurate positioning and grinding. 

    6. While grinding 12 inch of wafers, JL-300SCGII can grind 50µm of thickness. The grinding accuracy is 3µm, and the surface roughness of wafers can reach to 0.012µm.

  • JL-52CNC-LM is a newly developed CNC surface and profile grinding machine by JOEN LIH MACHINERY. 
    The vertical and cross feed movements are by CNC, and the longitudinal movement is driven by linear motor, which makes the processing efficiency faster than traditional surface grinder. For longitudinal movement, the table speed can reach 36M in one minute. Also, since the linear motor has less contact with mechanism, it owns higher dynamic reflection, longer stability and better positioning precision compared with ball screw. 

    The JL-52CNC-LM is suitable for grinding different shapes of punches and processing that requires high efficiency and accuracy. 


     


 Products

  • JL-300SCGII 晶圓減薄研磨機
    高精密晶瓷加工機。專為研磨加工硬脆材料打造,包括再生晶圓、矽晶圓、碳化矽、藍寶石、陶瓷和複合材料。 減薄矽晶圓最薄可達50µm。12吋晶圓研磨精度達 3µm,加工表面粗糙度達0.012µm!!...

  • 1. 高剛性氣靜壓主軸: 具有高潔淨, 高轉速、長壽命、 低噪音及低振動等優點。

    2.主軸迴轉精度可達0.1µm,具中央出水功能

    3.採用陶瓷工作台面可真空吸附、中央出水及自我研磨確保最佳幾何度

    4. 採縱向(Z軸)進給,解析度小於0.1µm。精準定位研磨,

    5. 減薄矽晶圓最薄可達50µm。12吋晶圓研磨精度達 3µm,加工表面粗糙度達0.012µm!! 

  • JL-50400CNC 線軌專用成型磨床
    線軌三面成型研磨機,可研磨15型以上滑軌! 可選擇搭配三大品牌控制器 (Fanuc / Siemens / Syntec)...

  • 型:JL-50400CNC                     頁次:1/1

         

    尺寸/數值

    加工範圍

    工作台面積

    mm

    400 x 4100

    最大研磨面機

    mm

    400 x 4875

    磁盤面積

    mm

    80 x 4080

    工作台載重

    Kgs

    2000

    T

    mm

    14 x 2 x 350

    磁盤面治工作檯面距離

    mm

    385

    雙主軸開距

    mm

    最小. 315 ~ 最大. 675

    砂輪上面至工作檯面距離

    最小. 355 ~ 最大. 480

    砂輪下緣至工作檯面距離

    最小. 0 ~ 最大. 390

    雙主軸

    伺服馬達

    Kw

    20/ 27.5

    主軸轉速

    Rpm

    1260 ~ 2270

    砂輪尺寸(外徑*寬度*內徑)

    mm

    ψ510 x 50 xψ203.2

    X

    左右

    進給

    行程

    mm

    5500

    油壓馬達

    mm

    40 (6 kw)

    左右移動速度

    m/min

    3~25 (油壓) 0~30 (伺服馬達)

    軌道

    V 軌道貼耐磨片+鏟花 (油壓系統)

    線性滑軌 (滾珠螺桿系統)

    Y

    前後

    進給

    行程

    mm

    180

    滾珠螺桿

    mm

    ψ40

    伺服馬達

    Kw

    2.85

    減速比

    齒形皮帶輪減速

    移動速度

    m/min

    3.3

    最小設定單位

    mm

    0.001

    軌道

    線性滑軌

    Z

    上下

    進給

    行程

    mm

    125

    滾珠螺桿

    mm

    ψ40

    伺服馬達

    KW

    2.85

    減速比

    行星式齒輪減速機

    移動速度

    m/min

    0.33

    最小設定單位

    mm

    0.001

    軌道

    線性滑軌

    砂輪修整器

    鑽石滾輪尺寸

    mm

    ψ102 x 最大. 80 x ψ50.8

    最高轉速

    rpm

    6000

    伺服馬達

    Kw

    1.57

    減速比

    齒形皮帶輪減速

    臥式副主軸

    馬達

    HP*P

    10 x 4

    主軸轉速

    rpm

    3200 ~ 1570

    砂輪尺寸

    mm

    ψ405 x 50 x ψ127

    臥式副軸Y軸前後進給

    行程

    mm

    440

    滾珠螺桿

    mm

    ψ40

    伺服馬達

    Kw

    1.57

    減速比

    Coupling

    移動速度

    m/ min

    20

    最小設定單位

    mm

    0.001

    軌道

    線性滑軌

    臥式副軸Z軸上下進給

    行程

    410

    滾珠螺桿

    mm

    ψ40

    伺服馬達

    mm

    1.57

    減速比

    Kw

    行星式齒輪減速機

    移動速度

    0.5

    最小設定單位

    m/ min

    0.001

    軌道

    mm

    線性滑軌

    尺寸

    機器尺寸

    mm

    14485 x 2610 x 2890

    佔地空間

    mm

    14880 x 4263 x 2890

    電流

    裝箱尺寸

    mm

    10900 x 2610 x 2890

    重量

    機器重量

    Kgs

    28400

    裝箱重量

    Kgs

    32000

  • JL-100VG 立式迴轉磨床
    適合長形、圓筒型工件的研磨加工!! 旋轉工作台直徑: Φ1050 mm,工作台乘載重量可達: 1200 KGS,加工範圍從Φ50 mm ~ Φ1250 mm!! 可依照加工廠需求採用電磁盤、夾爪及自動模具來固定工件,不需要依賴夾持治具夾持力。長型工件也不會有自重下垂和圓筒度不佳的問題,不會使工件變形或傷害工件表面!! 立式磨床的配置不會產生軸向軌道粉塵的問題,因其進給軸在加工區之上,加工粉塵不會堆積在軸向軌道上,延長機台使用壽命!!...

  • 機 型:JL-100VG          機 械 規 格              頁次: 1/1

         

    尺寸/數值

    旋轉

    工作台

    工件內徑研磨尺寸

    mm

    ψ50~ψ950

    工件外徑研磨尺寸

    mm

    ~ψ1250

    工件安裝高度(含夾具)

    mm

    600

    內徑研磨最大長度

    mm

    325 (內徑小於∮250)

    500 (內徑大於∮250)

    外徑研磨最大長度

    mm

    500

    工作台最大載重

    KG

    1200

    工作台直徑

    mm

    ψ1050

    移動轉速

    rpm

    10~80

    砂輪

    轉速

    rpm

    線速度<33M/S

    內研磨砂輪尺寸

    (外徑*寬度*內徑)

    mm

    ψ100x50xψ50.8

    外研磨砂輪尺寸

    (外徑*寬度*內徑)

    mm

    ψ305x75xψ127

    X

    左右

    進給

    行程

    mm

    1800

    滾珠螺桿(直徑*螺距)

    mm

    ψ50x16

    移動速度

    m/min

    24

    最小設定單位

    mm

    0.0001

    軌道

    線性滑軌

    Z

    上下

    進給

    行程

    mm

    700

    滾珠螺桿(直徑*螺距)

    mm

    ψ50x10

    移動速度

    m/min

    12

    最小設定單位

    mm

    0.0001

    軌道

    鋼軌

    頭部

    頭部傾角

    (°)

    22.5°

    馬達

    主軸馬達

    KW

    20(內藏式)

    X軸伺服馬達

    KW

    4.5

    Z軸伺服馬達

    KW

    5.5

    旋轉工作台伺服馬達

    KW

    11

    刀庫

    刀具數量

    6

    刀把型式

    HSKA100

    電流

    總額定電流()

    A

    重量

    機器重量

    Kg

    18000

    裝箱

    Kg

    空間

    佔地面積(長*寬)

    mm

    4400x4100

  • JL-52CNC-LM線馬平面磨床
    JL-52CNC-LM為準力新開發之線馬平面磨床~ 搭配線性馬達使加工效率比傳統磨床更快!!...

  • JL-52CNC-LM為準力新開發之線馬平面磨床~ 搭配線性馬達使加工效率比傳統磨床更快!!
  • JL-300SCG High Precision Wafer Surface Grinder
    Specially made for wafers of hard and brittle materials, like reclaimed wafers, silicon wafers, silicon carbide, sapphire, ceramics and composite materials. The machine ensures extraordinary grinding accuracy with surface roughness of wafers to 0.012µm....

  • 1. JL-300SCG II is used in grinding 8-inch to 12-inch wafers. It is specially produced for hard and brittle materials, such as reclaimed wafers, silicon wafers, silicon carbide, sapphire, ceramics and composite materials.  

    2. JL-300SCGII uses high-rigid aerostatics spindle which features in high cleanliness, high speed, long service life, low noise and low vibration. 

    3. The spindle has special designs of a built-in motor and central coolant through function. The spindle rotational accuracy can achieve 0.1 micro. 

    4. Both aerostatic spindle and ceramic vacuum suction worktable have central coolant through design, so you don't need to worry about the overheat problem. 

    5. Longitudinal Z-axis feeding resolution can reach to 0.1µm to achieve extremely accurate positioning and grinding. 

    6. While grinding 12 inch of wafers, JL-300SCGII can grind 50µm of thickness. The grinding accuracy is 3µm, and the surface roughness of wafers can reach to 0.012µm.