Connect with Heraeus Electronics to discover groundbreaking advancements in power module attachment with our new large area sintering technology. It promises to elevate your electronic manufacturing processes to the next level with its exceptional performance and efficiency. 

The second highlight will be an alternative, silver free, cost effective and highly reliable Si3N4 AMB substrate that fulfils the high requirements on heat dissipation and high-power density for automotive power modules.

Heraeus Electronics, a leading provider of advanced materials solutions, is pleased to announce the successful acquisition of the PriElex® electronics inks business line from Kayaku Advanced Materials Inc. The acquisition, effective January 31, 2024, strengthens Heraeus Electronics’ Thick Film business and expands its portfolio of offerings for the electronics materials industry

Heraeus Electronics has been awarded Best Material Supplier of 2022 by STMicroelectronics’ Bouskoura test and assembly site. The award was presented during the annual Supplier Day held on July 20, 2023 at the site in Morocco.

Heraeus Electronics, an expert in materials and matched material solutions for the electronics packaging, is one of five partners in the three-year joint project "KuSIn - Copper sinter processes using induction heating for electromobility applications", funded by the German Federal Ministry of Economic Affairs and Climate Action (BMWK).

Heraeus Electronics has been honored by Bosch, a leading global supplier of technology and services, with the renowned Bosch Global Supplier Award in the category "Raw Material and Components" for its exceptional performance.