• Booth: L1023
  • - 4th Floor

We have steadily increased our business performance and achieved stable growth, since our splitting off from Hitachi, Ltd. in an incorporation-type company split as of July 1, 2016, to respond to the demands of changing era and to pave the way for further growth and development.
Then, we have listed our stocks on the Second Section of Tokyo Stock Exchange (TSE) as of July 30, 2021. We deeply appreciate our customers, suppliers and other related parties for the supports extended to us.

Since the establishment of our production base in March 1990 at the current location of Ryugasaki, we have been making efforts to challenge new technologies from the customers’ viewpoints and to develop and commercialize them quickly and in a timely manner, and also supplying manufacturing equipment with the technologies bringing about Innovation to the existing manufacturing process, like Contact Printing/Coating for SMT (Surface Mount Technology) Printer, ODF (*1) System for FPD (Flat Panel Display), IJP (*2) Coating for LCD (Liquid Crystal Display).

In addition to manufacturing high-quality products which satisfy the customers’ requirements, we have been striving to strengthen LCS (*3) activities and expand our business as Solution Business for our customers' issues. We believe that this accumulation has established our firm position as of today.

Hereafter, observing our management philosophy "Create the Next by Advanced and Innovative technologies" with our constant challenge and ingenuity, we will make further efforts to become a global company to be relied on and supported by our customers, and to be a company contributes to the society by making peoples’ lives more convenient and prosperous.

※1 ODF: One Drop Fill 
※2 IJP: Ink Jet Print 
※3 LCS: Life Cycle Support


  • Plasma Laser Repair Equipment
    Plasma Laser Repair Equipment for semiconductor packages enabling Yield Improvement. Enable inspection and repair for solder ball drop defect during reflow and de-flux cleaning process after ball mounting....

  • Features

    1.Realized Inspection and Repair for Solder Ball Drop Defects during Reflow and Flux Cleaning Processes.

    2.High speed overall surface inspection for work(substrate and wafer).

    3.Flux dipping and high precision solder ball mounting.

    4.Soldering by plasma and laser technologies.

    6.Proposal for off-line or in-line system. 

    Basic Specifications

    No. Items Specifications
    1 Work Size Substrate: Max. 340L×250W (mm)
    Wafer: Max.12“ (φ300mm)
    2 Work Type Substrate (Epoxy Glass, etc.)
    3 Applied Ball Diameter 30um - 300um
    4 Inspection Method On the Fly Inspection
    5 Solder Ball soldering Method Plasma + Laser
    6 Cycle Time (Repair + Solder Ball soldering) 50 sec. (based on our conditions for evaluation)
    7 Equipment Dimensions W2,600 x D2,400 x H2,150mm
    (excl. Handling & Projected Portion)
    8 Equipment Weight 3,000 kg


    1.Package substrate and unit substrate after dividing(FCCSP,FCBGA,MGP/MPU.2.5/3D,FOPLP,etc.)


  • Solder Ball Mounter for Wafer
    Realized higher yield by applying ball mounting technology for semiconductor package wafer. Enable high quality and stable production by special flux printing technology....

  • Features

    1 Flux Printing

    ①Reduced flux bleeding by gap printing.

    ②Stable transfer position by one-direction printing mechanism.

    ③Minimized cleaning frequency.

    2 Ball Mounting

    ①New Infinity Head (Triple Type Rotary and Closed Type Squeegee)

    ②Higher Throughput

    ③Minimized sweeping frequency(1/3 compared with the conveintional type)

    ④Increased solder ball use efficiency(1/2 compared with the conventional type)

    3 Inspection and Repair

    ①Enable to systematize ball mounting system with inspection and repair equipment.


    No. Items Specifications
    1 Wafer Size Φ300mm
    2 Handling System Load port
    (FOUP or FOSB)
    Load port
    (FOUP or FOSB)
    3 Applicable Ball Size 40um~300um 80um~300um
    4 Alignment Accuracy <±10um <±15um
    5 Flux Printing Gap Printing
    (Single Direction)
    Gap Printing
    (Single Direction)
    6 Ball Mounting Adopted New Infinity Head (Triple Type Rotary & Closed Type Squeegee) Adopted New Infinity Head (Triple Type Rotary & Closed Type Squeegee)
    7 Ball Missing Rate <20ppm
    (as per AIM’s test conditions)
    (as per AIM’s test conditions)
    8 Throughput 65UPH
    (as per AIM’s test conditions)
    (as per AIM’s test conditions)
    9 Equipment Size 3995(W)x2150(D)x2020(H)mm 3555(W)x2150(D)x2020(H)mm
    10 Equipment Weight Approx. 3,500kg Approx. 3,300kg


    Wafer such as WLCSP,FOWLP,etc.

  • Nano-level High Precision Vacuum Assembling System
    High precision Vacuum Assembling System enabling nano-level assembling precision....

  • Features

    1.Higher precision was realized by newly developed nano-level alignment mechanism.

    2.Improved resolution by higher resolution camera.

    3.External micro-vibration control by vibration isolation control system(option)


    No. Items Specifications
    1 Work Size 8”(φ200mm)
    2 Work Materials Alkali-free Glass / Si
    3 Work Holding Method D-PSC / LVC Method
    4 Assembling Accuracy ≦100nm
    5 Assembling Load 0.5KN(Max)
    6 Vacuum Degree < 10-1Pa
    7 Equipment Size W2,800 × D2.400 × H2,900mm
    8 Equipment Weight 7,000kg


    1.Micro display(Micro LED,Si-OLED XR(AR/VR/MR),LCOS,HTPS)

    2.Optical Device(CMOS,Various Sensors)

    3.Sensing Device(LiDAR)

  • Solder Ball Mounter for Substrate
    Realized higher yield by applying ball mounting technology for semiconductor package substrate. Enable high quality and stable production by special flux printing technology....

  • Feature

    1.Ensure and deliver mass-production by 40um solder ball

    2.New rotary head provides high throughput (25% improved vs Conventional head)

    3.On the fly inspection is capable for large packages without any limitation.


    Items Specifications
    Line Configuration Flux / Ball printer / Inspection & Repair
    Panel Transportation Pick & Place (Vacuum pad) or Pick & Place (Clamp)
    Throughput(Tact Time) 65sec
    Applicable panel size Max. 420 x 300 - Min. 200L x 75W(mm)
    Applicable ball diameter 40 - 500(μm)
    Alignment repeatability < ±10um
    Missing rate (No ball ratio) < 20ppm
    Inspection method On the fly inspection (Non-stop imaging)
    Applicable max. unit size 120.0 × 120.0(mm)
    Inspection time (Reference) Approx 16sec./ 1/4 panel(144unit/panel)
    Repair With Flux W/O Flux Available
    Ball remove (for extra ball) Available