AEM Singapore Pte. Ltd.

Hsinchu City, 
Taiwan
http://www.aem.com.sg
  • Booth: K2988
  • - 1st Floor


WARMEST WELCOME TO AEM SINGAPORE EXHIBITION BOOTH AT K2988

About AEM 

AEM is a global leader in test innovation. We provide the most comprehensive semiconductor and electronics test solutions in wafer/chip handling, process automation and mixed-signal testing through our innovative test solutions. Along with our development in optoelectronics and software development in data analytics and machine learning, we set ourselves to redefine test through our Test Cell Solutions Business and Instrumentation Business.

Test Cell Solutions :

  • System Level Test Handlers
  • Final Test Handlers
  • Wafer Level Probers and Handlers
  • Automation Equipment
  • Interconnect, Panels, Kits and Sockets
  • Active Thermal Control Systems

Instrumentation Solutions :

  • Mixed Signal ATE
  • Test & Measurement Instruments

Beyond our leading-edge test innovation, we take pride in building strong partnerships with our customers and catering to the demands of an ever-evolving advanced manufacturing landscape.

AEM’s headquarters is in Singapore and has a global presence across Asia, Europe, and the United States. AEM has manufacturing plants located in Singapore, Malaysia (Penang), Indonesia (Batam), Vietnam (Ho Chi Mihn), China (Suzhou), and Finland (Lieto), and a global network of engineering support, sales offices, associates, and distributors, we offer our customers a robust and resilient ecosystem of test innovation and support.

Visit www.aem.com.sg and connect with us today.

AEM Taiwan Branch

7F-10, No. 1, Sec 3, Gongdao 5th Rd
Hsinchu City, 30042, Taiwan
Tel:  03 5720222
Fax: 03 5720333

Mr. Sam Au 
Director, Business Development
H/P: 0917-613-887
Email: sam.au@aem.com.sg


 Products

  • 1. M5S-HD ATE
    M5S-HD is part of AEM’s new generation, low COO, air-cooled, high-density flexible ATE series supporting a range of modular FPGA based instruments. A 10-slot version and application specific platform are available. Ideal for Engineering and Production....

  • AEM’s M5S-HD system has a flexible architecture supporting up to 1024 digital pins and 128 1A DPS in a 5-slot compact air-cooled system.

    Available, a range of modular FPGA based instruments that can fit in any slot to configure a cost-effective test solution for digital, mixed signal or application specific solutions

    The instruments enable a future proof roadmap of application specific enhancements. Instrument performance is optimized with a suite of calibration programs for timing and levels accuracy.

    The SW tools support Industry standards for factory automation, data logging and pattern conversion. The Software is built on a proven multi-threading architecture supporting parallel test >256 sites with minimal overhead. A range of manipulators is available for docking to probers and handlers to support full test cell integration. This platform provides a cost effective ATE test solution for many applications from design, characterization, and debug to high volume manufacturing at wafer and final test.

    AEM is also offering the M10S-HD (2048 digital pins and 256 1A DPS) and application specific solutions such as CMOS Image Sensors.

  • 2. ATOM Benchtop IC Handler
    The ATOM-IC Handler is one of AEM range of product. It is an automated robotic material handling system intended to transfer packaged semiconductor devices from trays to a test contactor and to sort them into trays after test....

  • AEM’s ATOM IC Test Handler can handle most standard semiconductor packages ranging in size from 6mm to 55mm. The system can accommodate most BGA, LGA, QFP, QFN, PLCC, POP, DIP, and PGA devices and many others. Smaller sizes may be handled in many cases.

    The system has two binning modes:

    Mode 1 (SORT, 1 IN 2 OUT) utilizes one input tray with devices to be tested, and two empty output trays. - The parts are picked from the input tray, presented to the contactor, and then sorted to the appropriate output tray based on the binning signal sent by the tester.

    Mode 2 (ALL TEST, 3 INPUT) utilizes up to 3 input trays, all containing devices to be tested. – Each device is tested and returned to the same location in the same tray from which it was taken.

    The system also has a device precising option. If selected, the system can precise the part to insertion into the test socket. Precising is used in cases where the device tray has insufficient precision and/or the test socket has insufficient lead-in to allow the device to be dropped correctly and accurately. Device rotation (optional) can also be performed.

    The system utilizes a simple digital input/output logic methodology to interface with a test system. RS232 and GPIB communication options are also available.

    The system is flexible, with options to be used as a table-top operation, or on a cart, to interface with most standard ATE test equipment (test heads).

    The system can be used with several thermal control systems to enable ATC and hot/cold testing. The temperature range of the test is determined by the device to be tested, its power dissipation, and the type of thermal control system used.

  • 3. NESTEK TEST SOCKETS
    NESTEK's SOCKET is a high signal integrity, high pin count, high power, high frequency tand high thermal test interface medium between TESTER and DUT for various types of packages (BGA, LGA, QFN, QFP, CSP, TSOP, SOP, etc.)....

  • NESTEK SOCKET is used together with NESTEK PIN as an interface of TEST and is a device to inspect electrical defects, characteristics, and functions. It is a product widely used not only for a comprehensive solution for logic tests such as various PoPs and multi-para test sockets, but also for inspection/testing of HPC, Logic, PMIC, RF, MEMORY, camera modules, and display modules.
  • 4. NESTEK TEST PINS
    NESTEK PIN is a medium for inspection/testing of semiconductor IC and electronic module....

  • NESTEK PIN can be produced with barrel outer diameter of ø0.15~7.0 and length of 1.5~93.0mm.

    It is used for O/S (Open, Short) test, function test, and SLT test of various semiconductor packages including BGA, LGA, QFN, QFP, as well as various types of inspection of various camera modules and display modules.