Indium Corporation

Singapore,
Singapore
http://www.indium.com

Booth: J2456
- 1st Floor

Indium Corporation's advanced materials for semiconductors!

Indium Corporation^® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil® . Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

Press Releases

Indium Corporation to Showcase GalliTHERM™ Liquid Metal Technology and No-Clean Semiconductor Flux at SEMICON Taiwan (20220825)
Indium Corporation^® is proud to feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan.

Indium Corporation’s technical expertise and innovative portfolio of proven products continue to make it a leading industry partner in material solutions for advanced packaging.

Indium Corporation is excited to showcase products from its GalliTHERM™ portfolio of gallium-based liquid metal solutions. This innovative product line draws on the company’s more than 60 years of experience in manufacturing gallium-based liquid metals. Indium Corporation also offers significant global technical support to help customers ensure their liquid metal thermal solutions meets their application needs with low- and high-volume production available in the U.S. and Asia.

Indium Corporation offers a number of innovative high-performance metal TIM solutions. With its portfolio of alloys that are liquid at or near room temperature, Indium Corporation's liquid metal TIMs are designed to offer superior thermal conductivity for both TIM1 and TIM2 applications. Liquid metal TIMs offer:
- High thermal conductivity, enhancing end-product longevity and reliability
- Low interfacial resistance against most surfaces, ensuring they dissipate heat quickly
- Extraordinary wetting ability to both metallic and non-metallic surfaces
Liquid metal TIMs are available in a variety of alloys, including InGa and InGaSn.

Indium Corporation's m2TIM^TM combines liquid metal with a solid metal preform to provide reliable thermal conductivity for heat dissipation without the need for a solderable surface. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.

Available in InGa and InGaSn, this m2TIM^TM hybrid approach provides extraordinary wetting ability to both metallic and non-metallic surfaces and low interfacial resistance. It also reduces the risk of pump-out of the liquid alloy.

As the industry leader in no-clean semiconductor flux, Indium Corporation will also feature the first no-clean, ball-attach flux on the market, NC-809. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.

NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.

NC-809 offers:
- High tackiness to eliminate die tilting or shifting during reflow; greatly reducing electrical open failures
- Consistent flux deposition and excellent wetting
- Ultra-low residue; ideal for customers building tight-pitch flip-chip assemblies
- Compatibility with a wide variety of underfills
- Reduced warpage of package and lower thermal stress due to absence of cleaning step
For more information Indium Corporation’s suite of proven ultra-low residue fluxes, visit www.indium.com/products/fluxes/semiconductor-fluxes/. To learn more about the company’s cutting-edge soldering and thermal materials, visit Indium Corporation’s experts at booth #J2456.

About Indium Corporation

Indium Corporation^® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

Indium Corporation’s Jason Chou to Present at SEMICON Taiwan (20220825)

Indium Corporation senior area technical manager, Jason Chou, will present on low-temperature solders at SEMICON Taiwan’s TechXPOT on Thursday, Sept. 15, in Taipei, Taiwan.

In Lead-Free Low-Temperature Solder Paste for Drop Shock Critical Applications, Chou will focus on Durafuse™ LT, a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. The innovative material provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup. Durafuse™ LT is the only existing solution that ensures reliability with low-temperature requirements and is ideal for customers seeking low-temperature solder paste to address warpage issues, step soldering, and reduced energy consumption.

His Chinese-language presentation is scheduled for 10:10 a.m.–10:40 a.m. local time at booth #I2026, in the Innovative Technology and Product category.

As senior area technical manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

Products

Liquid Metal for thermal management

We are a leader in high-performance liquid metal-based thermal interface materials (TIM) with advanced knowledge and experience in high-volume TIM0, TIM1, and TIM2 applications. ... More Info Less Info

Our Gallitherm™ portfolio of gallium-based liquid metal solutions draws on more than 60 years of experience in manufacturing gallium-based liquid metals. We offer a number of innovative high-performance metal TIM solutions. With a portfolio of alloys that are liquid at or near room temperature, our liquid metal TIMs are designed to offer superior thermal conductivity for both TIM1 and TIM2 applications. Liquid metal TIMs offer:

High thermal conductivity, enhancing end-product longevity and reliability
Low interfacial resistance against most surfaces, ensuring they dissipate heat quickly
Extraordinary wetting ability to both metallic and non-metallic surfaces
Liquid metal TIMs are available in a variety of alloys, including InGa and InGaSn.

Indium Corporation's m2TIMTM combines liquid metal with a solid metal preform to provide reliable thermal conductivity for heat dissipation without the need for a solderable surface. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.

Available in InGa and InGaSn, this m2TIMTM hybrid approach provides extraordinary wetting ability to both metallic and non-metallic surfaces and low interfacial resistance. It also eliminates the risk of pump-out of the liquid alloy.

Durafuse™ LT low-temp alloy

Durafuse™ LT is a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C.... More Info Less Info

Durafuse™ LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimium process setup. Durafuse™ LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse™ LT is ideal for high-reliability applications which utilize thermally sensitive components or boards and/or have a requirement for step soldering.

Durafuse™ HT pb-free high-temp alloy

Durafuse™ HT is a drop-in replacement for high-Pb solder, with no special equipment needed and minimal process adjustments.... More Info Less Info

Durafuse™ HT features a novel design based on a mixed-alloy technology, designed to deliver a tin-rich HTLF paste, presenting the merits of both constituent alloys. It delivers:

Simplified processing
Enhanced thermal cycling reliability; equal or higher than high-Pb solder
Lower RDS(on) compared to high-Pb solder

SiPaste® Solder Paste

Indium Corporation’s proven SiPaste® series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 7.... More Info Less Info

From water-soluble to no-clean soldering solutions, flip-chip fluxes, and novel mixed alloy technologies, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch SiP and heterogeneous integration and assembly (HIA) applications.

Indium Corporation’s proven SiPaste^®series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 7. They help Avoid the Void^®, reduce slumps, and demonstrate consistent superior printing performance. Water-soluble SiPaste^® 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules. SiPaste^®C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.

SiPaste^® 3.2HF formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s miniaturization in SiP design. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.

Exceptional printing
Long stencil life
Good response-to-pause
Wide reflow profile window
Outstanding slump resistance
Excellent wetting capability
Superior fine-pitch soldering ability
Low-voiding
Halogen-free

SiPaste^®C201HF exhibits many of these same benefits, with particular formulation consideration to provide exceptional paste release on sub-80-micron apertures, stable print performance leading to long stencil life, and high tackiness to prevent component shift. This combines with a cleanable chemistry with semi-aqueous-based solutions, allowing for ease of cleaning with minimal cost.

No-Clean Flip-Chip and Ball-Attach Fluxes

NC-809 is a new halogen-free, ultra-low residue, flip-chip flux NC-26S/A is a halogen-free, no-clean flip-chip dipping flux NC-699 is a halogen-free, no-clean flip-chip dipping flux ... More Info Less Info

NC-809 Flux is a halogen-free, no-clean, ultra-low residue flip-chip flux, which is designed to leave minimal residue while maintaining proper wetting and exhibiting high tackiness. The reduction in residue optimizes underfill adhesion and decreases void formation by reducing outgassing in the underfill curing process. It exhibits proper wetting due to its specially designed manufacturing process, which makes the material suitable for both flip-chip dipping applications and certain waferlevel BGA ball-mount applications. It has high tackiness, which makes this material suitable to hold die in place during assembly, preventing shifting- or skewingrelated defects.

Flip-Chip Flux NC-26S is a halogen-free, no-clean flip-chip dipping flux, which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.

Flip-Chip Flux NC-699 is a halogen-free, no-clean flip-chip dipping flux, which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.

NC-702 No-Clean, Halogen-Free Adhesive Solution

NC-702 is a no-clean, near-zero residue, halogen-free adhesive solution designed for holding chips, dies, or solder preforms in place to prevent skewing and tilting during placement and reflow processes.... More Info Less Info

NC-702 is a no-clean, near-zero residue, halogen-free adhesive solution designed for holding chips, dies, or solder preforms in place to prevent skewing and tilting during placement and reflow processes. Its chemical design enables it to hold a die in place during reflow and evaporate out while formic acid is released to enhance soldering. Its halogen-free nature makes NC-702 environmentally-friendly, as well. Its near-zero residue feature also makes it compatible with the subsequent molding or underfill processes, without the risk of delamination.

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