ITW EAE

The Prodigy™ dispenser is designed and built to deliver high-speed, extremely accurate dispensing. A state-of-the-art XY gantry system is the heart of the system. A rigid frame design and advanced linear drive enables fast point to point moves, high accuracy and long term repeatable performance.

NuJet™ is a new jetting technology for the Prodigy that eliminates the use of a needle and incorporates a state-of-the-art pneumatic actuator that generates an operating frequency of up to 300Hz.  

Dynamic Dual Head™ (DDH) offers the unique ability to double dispense speed while maintaining the highest level of accuracy for both dispense pumps. The patented design corrects for part to part rotation in “real-time” allowing synchronous dispensing of both pumps. 

New IR Temperature Sensors measure in “real time” the top-side board temperature. Closed-loop control maintains the product within the specified temperature range ensuring process stability and increasing yields for underfill applications.

Camalot will be presenting live demonstrations of its Advanced Tilt and Rotate dispensing system. This innovative and new Camalot design reduces wet out areas and improves capillary flow for underfill by accurately dispensing on the side walls of packages. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility. 

The MPM® Edison™ meets the challenge of component miniaturization in the semiconductor market with proven print process capability greater than 2 Cpk for 0201 metric components.

• ±8μ @ 6 sigma alignment repeatability (≥2 Cpk)
• Optimal coplanarity: Ultra-tight coplanarity between stencil and substrate
• No print deviation: Single load-cell closed-loop squeegee-force control eliminates front-to-back variation and maintains set force across the entire board surface
• Highly effective stencil wiping: Patented paper tension control
• Contamination free print area: separate wiping and printing zone prevents cross contamination
• Secured thin substrate for consistent print quality: Venturi adjustable vacuum system
• Consistent printing quality and stencil protection: Large, flat blade-landing zone
• Minimized changeover: Super-size 5-inch (12.7cm) diameter paper roll
• Adaptable down to18-inch stencil: Adjustable stencil shelf and adapter

• Small footprint: Compact design

·       Industry 4.0 connectivity: OpenApps for customizable MES interface

MPM will be presenting live demonstrations of the Edison II ACT™ (Automatic Changeover Technology) which is in the final stage of development. This innovative patent pending technology provides a simple, cost-effective solution that can be implemented in progressive stages towards full automation. It is designed to be easy to use and simple to adopt and requires no additional skills to operate. The system includes automated changeover of the stencil, tooling, and squeegees along with an automated paste changeover system for fast and consistent changeovers. 

Electrovert cleaning equipment plays a critical role in semiconductor fabrication and are utilized in multiple steps, including degreasing, cleaning prior to electroplating and underfill, cleaning after bumping and wire bonding, and carrier debonding of fan-out packages.

Cleaning helps to remove flux residue, excess adhesive, grease and oils to ensure proper bonding and material distribution and avoid defects and increase yields. Electrovert cleaners are designed to deal with small, lightweight semiconductor products such as lead frames, BGAs, wafers and 3D stacked packages. 

The Aquastorm® delivers a small spray-jet mist that is less than 40 PSI. It delivers a dynamic combination of chemistry, thermal, and mechanical forms of energy at the surface to effectively clean under low stand-off and difficult to clean components. 

Integrated into the machine cabinet, the Torrid Zone™ delivers a controlled dynamic process that effectively removes moisture. Typical performance includes drying complex assemblies to within 0.1 gram of prewashed dry weight. The technology reduces exhaust requirements by 44% and uses 15% less power than conventional drying systems

Meeting the most critical and demanding semiconductor reflow requirements.

With an efficient heat transfer design, Centurion has a low energy consumption rate. Its reliable and robust design, backed by over 20 years of experience and capability, ensures high uptime even with the toughest reflow requirements. The patented CATHOX™ (Catalytic Thermal Oxidizer) dramatically reduces maintenance requirements while keeping a clean process environment that is critical for Semiconductor processing. 

Tight, closed-loop process control including closed-loop temperature controlled water cooling enables semiconductor customers to control cooling zones just like heating zones and meets the special cooling rate requirements for the industry. 

Nitrogen atmosphere is used to reduce oxidation of surfaces and minimize voids in the interfaces. Centurion’s chamber design in Nitrogen systems prevents air from getting into the process. It also comes standard with a quick purge system. Optional closed-loop PPM control automatically regulates oxygen levels. Nitrogen recirculation in the Flux Management System significantly reduces nitrogen consumption.

The Centurion offers smart software solutions that provide traceability, performance verification and enhanced efficiency. The new "idle mode" reduces power and nitrogen consumption when the machine is idle, reducing power consumption by up to 35% and nitrogen by up to 40%.

Despatch ovens have superior temperature uniformity of ± 0.5% of setpoint and offer SEMI S2/S8, CE, and SECS/GEM communication. Low particulate environmental controls protect from contamination and low oxygen levels prevent oxidation. Despatch ovens are used for adhesive bonding and curing, encapsulant curing, underfill curing of CMOS optical sensors, die attach and BGA, B-stage adhesive curing, polyimide curing, metallic thin film annealing, and photoresist curing.

The Despatch PCO2-14™ electrically heated oven was designed to meet the specific process requirements for hard baking polyimide coatings in an inert atmosphere. This high-performance, clean process oven (ISO Class 5/Class 100 recirculated airflow) offers many unique components, including a pressure relief system, an oxygen control system and a process monitoring system which allows the oven to achieve the strict oxygen level and atmospheric requirements involved in polyimide curing.