ITEC

The most advanced modular parameter test system for discrete semiconductors up to 6 or 12 leads. With ultra-short test times, this tester is capable of testing up to 92000 devices per hour with a single test handler — the fastest test cell on the market. This tester can be used as a wafer tester, a PCM tester and as a final tester in the back-end. nanoParset occupies minimal floor space. Up to four test heads can be combined as one to test 24-pin packages at the highest possible throughput. Fast Kelvin checks without switching relays to prevent breakage. 

Eliminate the trade-off between quality and productivity with high-definition inspection executed on the fly without any speed penalty. At four times faster than anything on the market, this is the industry’s leading strip-to-strip die bonder for leaded or leadless packages with glue or DAF/WBC applications. The ADAT3 XF DBSG eliminates manual wafer change and speed drop, plus is capable of handling die as small as 0.2 x 0.2 mm.

Gain maximum productivity at the lowest costs. At 20% faster than anything in the market, this is the die sorter for wafer-level CSP/micro CSP applications. It handles the smallest die with automatic wafer change. The ADAT3 XF DS also inspects all six sides of the die without any speed penalty, securing quality in this critical last process step — without compromising productivity or cost.

The most cost-efficient diced-wafer inspection system on the market. With ultra-high-speed vision scan and high-precision wafer 2D inspection, the Post Dicing Wafer AOI enables conversion for 6", 8", and 12" wafer frame film carrier cassette. It guarantees the quality of diced wafer, allows a fast feedback loop, and prevents wafer yield loss. When cost and quality of manufacturing are a concern, this diced-wafer inspection system offers a tight wafer supply to eliminate wafer damage due to dicing issues. WIF offers inspection after wafer dicing to detect surface defects or inspection after package singulation of DFN to detect package, mark, lead, and plating defects. Advanced Defect Classification (ADC) by hybrid analysis will enhance manufacturing efficiency and competitiveness.