Jipal Corporation

Hsin Chu, 
Taiwan
http://www.jipal.com
  • Booth: N0170
  • - 4th Floor

Welcome to Jipal,

   Jipal Corporation –

  • We are an engineering services company.
  • Jipal was established in June 1990, dedicated for SEMICON Back End Packaging Equipment, Material selling, and full coverage of technical consult and product service support.
  • Territory started from Taiwan, extended to China and SEA, over 20 locations of Jipal offices among of Asia.

Our Principals –

  • AEMULUS
  • AIMECHATEC
  • ALLTEQ
  • AMESS
  • ASAP
  • ASAHI
  • Aurigin
  • CAPABLE
  • centrotherm
  • EMAGE
  • FURUKAWA ELECTRIC
  • FASFORD TECHNOLOGY
  • GSP
  • MARS TOHKEN (Hitachi High-Tech)
  • HOVER-DAVIS
  • IKK
  • INTELUME
  • ITW EAE
  • KINIK
  • KINERGY
  • KLA
  • KOBAYASHI & CO., LTD
  • Legend
  • MKE
  • NIPPON KAYAKU
  • Okamoto Machine Tool Works. LTD.
  • ORION SYSTEMS INTEGRATION
  • PAL
  • TEIKOKU
  • UBCT

   Jipal always back you up!


Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Ball Placement; Attach Systems
  • Base Loader Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Device Handling; Feeding Systems
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Molding; Encapsulation; Decapsulation Equipment
  • Package Handling; Conveying Equipment
  • Solder Reflow; Soldering & Brazing Equipment
  • Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
    • 202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Lamination; Sheet Laminating Equipment
    • 203 Equipment, Inspection & Measurement
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
    • 208 Equipment, Test
  • Linear Test Systems
  • Logic Test Systems
  • Memory Test Systems
  • Optical Test Systems
  • Package Test Systems
    • 300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Package Substrates; Laminate; Film based
    • 302 Materials, FPD
  • Alignment Film Materials
    • 502 Material Handling Systems
  • Conveying; Material Handling Systems
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