Jipal Corporation

Main Features:

• Hi-speed Productivity : 36,000 (Dry-run), 24,000 (Actual run)
• 300x100 Strip capability, 1.3x1.3 picker capability
• High warpage handling 5HP vacuum pump, 379.94 mm2 piping area
• Strip In Strip Out Lead Frame Half-Cut/Isolation process
• Strip in strip out for high warpage/alignment o strip
• Dual Saw-Chuck table DFD6750 and Dual Package Drying & Cleaning system
• Livebug/Deadbug Flipping Option after Sawing process
• High-precision control & movement by Linear motor
• 2 x 8 Individual pickers with auto Rotation for Unit Orientation and Placement Accuracy
• Universal type Vacuum Picker design
• 2D code and Strip mapping traceability up to Tray
• Unloading Option : JEDEC Tray / Tube / Canister / Bulk and TNR

Other Options:

• Centralised UI for Dicer and Handler
• Package side Brush-cleaning / 5 Side Vision / 3D Inspection for BGA Inline Integration to Laser QFN Pre-cut and Laser marking

Main Features:

* Ensure and deliver mass-production by 40um solder ball.

    Flux Printing

• Reduced Flux Bleeding by Gap Printing.
• Stabled Transfer Position by One-direction Printing Mechanism.
• Minimized Cleaning Frequency.

    Ball Mounting

• New Infinity Head (Triple Type Rotary & Closed Type Squeegee) & Higher Throughput.
• Minimized Sweeping Frequency (1/3 compared with the conventional type)
• Increased Solder Ball Use Efficiency (1/2 compared with the conventional type)

    Inspection & Repair

• On the fly inspection can provide High speed inspection (Non-stop imaging)
• Miss balls and extra balls are capable for repair.

Other Options:

• Inline Integration to Inspection & Repair System.
• Customized to run Film Frame Carrier.

The machine shall be exhibited at AIMECHATEC’s booth, L1023

Main Features:

• Enabled Inspection and Repair for Solder Ball Drop Defects during Reflow and De-Flux Cleaning Process after Ball Mounting.
• Realized Spot Reflow soldering (local soldering for only repairing points) by integrating Plasma and Laser Technologies.
• Minimized Reflow Process impacting qualities of Semiconductor Packages.
• Realized Inspection & Repair for Ball Drop Defects during Reflow and Cleaning Process.
• High Speed Overall Surface Inspection for Works.
• Flux dipping & High Precision Solder Ball Mounting.
• Soldering by Plasma & Laser technologies.
• Proposal for Off-Line or In-Line System.

Main Features:

• Complete inspection portfolio.
  • Incl. 3D loop height at 11µm repeatability.
• High speed enables 100% inspection.
  • Example: 120 strips/hr for 9"x2" size.
• Robust scanning: OTF capturing of 6 images/FOV.
• Including HR station for review or specific ROI.
• Experienced team.
• Simple design, & user-friendly recipe setup.
• Image stitching – Panoramic Technology.
• OTF, single FOV, Subpixel stitch accuracy.
• No FOV limitation for bigger devices.
• Ability to cover any packaging/ device type in Semiconductor.

Wafer Grinding Wheels  [晶圓研磨砂輪]

Features:

• Wafer grinding wheels perform a stable high removal rate, longer lifetime and lower/consistent grinding resistance during processing.

Application:

For thinning process of

•  TSV package wafers (Cu/compound).
•  SiC, sapphire, Si and reclaimed wafers.
•  MEMS/LED, diode etc.

Specification:

Dressing  Board  [修刀板]

Features:

• Dressing board, with flatness to firmly suction on chuck table larger than 80Kpa, can efficiently remove clogging and glazing of dicing blade with less consumption.

 Application:

• Dressing board is used to pre-shape a new dicing blade by trimming its uneven edge and to expose diamond grits on its edge for cutting.
• Dressing board is used to re-sharpen a dicing blade by interval dressing to restore and maintain the stable cutting ability during processing.

Specification:

Porous Ceramic Chuck Table  [多孔質陶瓷真空吸盤]

Features:

• High-performance,  High-precision,  Uniform suction force.
• Partial chucking without sagging.
• Chucking and transport of wafer without leaving suction marks.
• Produces no static electricity and dust.
• Reusable (after rework)

Application:

• High precision porous vaccum chucks are suitable and can be tailored for grinding,   cleaning, dicing and measuring processes of semiconductor wafers etc. upon customers' request

Specification: