JTEKT THERMO SYSTEMS

北投區,  台北市 
Taiwan
http://www.jtekt-thermos.co.jp
  • Booth: N1289
  • - 4th Floor


Welcome to our page, will do our best to solve your needs.

Introducing heat treatment equipment for following material
- φ8 inch SiC wafer (Activation, oxynitriding and contact annealing)
- GaN wafer
- IGBT wafer
- MEMS
Showing very excellent performance of temperature uniformity for following process
- Heat treatment for latest packaging technology, "FO-PLP"
- Wet-oxidation at low temperature process for "VCSEL"
Demonstration test is available. So please come to our booth and ask us it.


 Products

  • VF-5900 Vertical Furnace for 300-mm Wafers
    This furnace is a heat treatment system for silicon wafer, IGBT, polyimide and thin wafer oxidation, diffusion and CVD. As our flagship model, this furnace is equipped with a large-capacity stocker and features a short cycle time....

  • Large batch, Max 100 wafers batch processing

    • Max 16 FOUP stocks
    • Excellent temperature control from low to midium high temperature range by use of LGO heater
    • High-speed wafer transfer by use of single/five wafers handling robot
    • Equipped with an operator-friendly high performance control system

  • VF-5300 Stocker Type Vertical Furnace
    This vertical furnace with a built-in stocker processes 8-inch wafers at ultra-high temperatures in large batches.<br />Would be a semiconductor heat treatment system that can perform oxidation, diffusion, LPCVD, activation annealing ....

  • Large batch, max 150 wafers batch processing

    • Max 20 cassette stocks
    • Excellent temperature control from low to medium high temperature range using an LGO heater
    • High-speed wafer transfer by use of single/five wafers handling robot
    • Equipped with an operator-friendly high performance control system

     

  • VF-5300 Stocker Type Vertical Furnace HL
    Adopted MoSi2 heater, maximum process tempurtare1400 ℃.<br />This vertical furance is best compatible to SiC Power Device oxidized .<br />Capable to Wafer up to 8 inches, offering 100 pieces (6 inches) to 75 pieces (8 inches) high rationality.<br />...

  • Processing up to 100 pieces (φ6 inch), up to 75 pieces (φ8 inch), compatible with from R&D to mass production needs.

    • Max 20 cassette stocks
    • Excellent temperature control from low to medium high temperature range using an LGO heater
    • High-speed wafer transfer by use of single/five wafers handling robot
    • Equipped with an operator-friendly high performance control system

  • VF-3000 Low-Cost Mini Batch Vertical Furnace
    This low-priced vertical furnace equipped with an auto conveyor can be used for a range of functions from R&D to mass production of 4- to 8-inch wafers. We have achieved such a low price that back end users can introduce this furnace....

  • Low-cost equipment for back end users .

    • Max 20 cassette stocks
    • Excellent temperature control from low to medium high temperature range using an LGO heater
    • High-speed wafer transfer by use of single/five wafers handling robot
    • Equipped with an operator-friendly high performance control system

  • RLA-4100、3100 series for lamp annelling
    Vacuum load-lock capability improves throughput.<br />Supports various wafers including Si, GaN, and SiC....

  • Vacuum load-lock is equipped as standard on the chamber and transport unit, for high throughput. Includes an automated susceptor transfer function for SiC and GaN wafers. Halogen lamps are installed in both an upper and lower cross. 6 zone control allows easy control of the power ratio for each zone. Non-contact measurement of workpiece temperature is performed using radiative thermometers, and feedback control is possible.

  • SO2-12-F Heated-air Circulating Type Clean Oven
    <br />Clean oven for Φ300mm and □ 600 large boards for Fan Out. A unique seal structure is used to achieve an oxygen concentration of 20 ppm or less. Supports warp correction annealing and polyimide curing processes....

  • Compatible with large boards up to Φ300 mm and □ 600 Maximum 50 sheets / chamber (15 sheets at size □ 600) Compatible with MAX2 chambers Low oxygen concentration treatment is possible (20ppm or less) Cleanliness corresponds to class 100 (ISO class 5) (When the temperature is stable) It is possible to transport the warped board by the original chuck method.