LONG HONG INTERNATIONAL HIGHTECH CO., LTD.

Regarding the soldering method, the sequence is: the solder balls in the solder storage are transported to the disk, and the disk is rotated to separate the solder balls by the centrifugal force.

The separated solder balls pass through a capillary tube, where nitrogen is added to propel the solder balls.

Finally, the laser is synchronized with nitrogen to melt and bump the solder balls to the designated positions.

And it has the Flux post treatment process to optimize the solder balls to ensure the consistency of the appearance and height of the solder balls.

The technology can be applied to Ball Grid Array (BGA for short) and wafer level packaging (WLP for short), and has the advantages of high density, good thermal conductivity, and low inductance pins.

Among the four processes, the most vital thing is solder ball bumping, which is the part that affects the whole soldering the most.

The precision of each axis affects the precision of the solder ball ejection position. In order to enhance the precision, Dawon Nexview is equipped with high-precision driving components and a granite-based platform, and uses a vacuum chuck to adsorb and set the worktable.

In order to make the equipment meet the needs of customers in the advanced process (adding flux, heating, etc.), in addition to the standard processing head (SPH), the advanced processing head (APS) can also be configured separately, which is different from the standard processing head (SPH), Standard head, and can efficiently perform complex operations.

【Device application】

The solder balls are extremely small and size cover range is 45um~80um.

Common applications for soldering: PC substrates, USB TYPE C connectors and other fields are no longer a problem.

The most notable thing is that this device is a product developed for "wafer packaging". The working table is guaranteed to be able to set up a space for an 8-inch wafer, and there are vacuum chucks specially used to set the wafers.

【Product advantages】

- High reliability proven fiber laser source

- Independent hight speed digital processor (for high speed and precision laser & pressure control)

- Solder ball feeding safety functions

- High resolution alignment vision with auto focusing

- Customized working table size (quad size/half size substrate or 8-inch wafer table customizable)

- Simple changeover through disk, spacer, capillary

- Various options

【Specification】

Laser source wavelength: 1,070nm

Output power: 30W

Laser life time: Max. 350,000 shot times

Size cover range: 45um~80um

Bumping speed: ≤ 0.4 seconds/piece

Platform reproducibility: ±1um

Working area: 200mm*200mm (can contain 8-inch wafers)

Power voltage: 220VAC

【PROBE CARD TYPE】

It is suitable for the manufacture of probe cards for DRAM, NAND FLASH, and CIS that require one-touch testing at the wafer level.

【LASER PIN CUTTING SYSTEM】

A device that vacuum-absorbs the probe pin wafer produced in the semiconductor engineering, and cuts and separates the connection part of each pin with a laser.

＜SPEC＞

－Equipped UV Nanosecond Pulsed Laser ( Picosecond Option)

－Cutting Accuracy <±15μm

－Cutting Time: <0.6sec/point

－4”, 6” wafer pin (8” , 12” Option)

【PIN INSERT SYSTEM】

The cut probe pin is provided in dummy state or wafer state. The position is identified by vision, and it is automatically loaded to tray one by one.

＜SPEC＞

－High-speed work with Vacuum Picker Head and Inserting Gripper Head

－Tact Time : < 5 sec / pin

－Equipped High Precision Alignment Vision

－4”, 6” wafer pin (8” , 12” Option)

【LASER MICRO-BONDING SYSTEM】

After manufacturing wafers such as DRAM, NAND Flash, and CIS, in order to select defective products, it is a device for ultra-precision welding of tiny probe pins on the probe card substrate required for wafer-level testing.

＜SPEC＞

－Bonding Accuracy ±5um (X, Y), ±8um (Z) within 300mm wafer

－Less 10 sec/pin tact time @ standard bonding condition

－Equipped Auto focusing Camera

－±1um position repeatability

－60um pitch bonding

＜BONDING PROCEDURE＞

This project is divided into two procedure. The transfer gripper is used to transfer the probes supplied to tray one by one to the pre-align zone. The bonding gripper is used to apply solder paste to the pre-aligned probe and arrange it on the ceramic substrate. Finally welding with Laser.

【PROBING MARK INSPECTION SYSTEM】

In order to confirm the final quality of the assembled probe card, after linking the probe card to the wafer, vision checks the remaining probe marks after the link to determine the quality of the equipment.

＜SPEC＞

－0.1 sec/mark Fast Inspection Speed

－Probing Mark X, Y Deviation and Dimension Inspection

－Provide Various Analysis Report

－High Resolution 5M B/W CCD Camera (2,464 X 2,056 Pixels)

－Less 0.1um Pixel Resolution (FOV 2.1 X 1.8 mm)

Kuge automatic packaging alignment system is not only suitable for passive components, but also can use active component assembly solutions.

Kuge models are widely used and have high flexibility in machine configuration. The equipment has also been designated by many leading manufacturers and well-known academic units. For example: Japan NTT, Fujikura, Panasonic, Sumitomo, Sony, Tokyo Institute of Technology, Tokyo University, etc., with full industry reputation!

▶This equipment has 12 axes.

<Packaging stage unit> Package BTF/LD/PD, 3-axi automatic stage axi(PX,PY,Pθz), gimbal, BTF/LD/PD holder.

<Focus stage unit> 2-axi automatic stage axi(FZ,FθZ), fiber, plug holder.

<Sleeve stage unit> 3 Corresponding to 3-piece, automatic stage axi(SZ), sleeve holder.

<YAG stage unit> There are 3 YAG units, and every unit has 2 axes(LZ,LF,CZ,CF,RZ,RF). Camera and monitor for observation.

▶Advantages

-Dedicated high-rigidity SUS automatic stage with low thermal expansion, optimizing the stability of alignment.

-The alignment  accuracy of the equipment repeated packaging is < 0.1 um, and the stage dissociation energy is 0.025 um.

-The equipment is integrated, and it is not easy to be damaged during handling and moving.

Precitech has added an innovative vertical axis to our field proven large frame platform, increasing flexibility and precision. With the Freeform L, customers can diamond turn, micro-mill, micro-grind, and groove non-rotationally symmetric surfaces. Adding this third linear axis gives users the flexibility to produce freeform surfaces which may not be achievable using 2 linear axis machining.

【Product advantages】
- Industry leading swing and load capacity

- Flexibility to produce freeform geometries with 3 linear and up to 2 rotary CNC axes

- 5 Axis freedom with 3 axis performance Y axis and spindle designed for maximum thermal stability

- Thermally controlled enclosure options insure accuracy during long cutting-time parts

- Reduced sensitivity to vibration enabled by its integral TMC MaxDamp® isolation system

- Capability to produce large and small parts auxiliary spindle mount to the X axis

The new generation devices provide for the first time an absolute measurement accuracy of better than ±50 nm (3σ) up to 90° object slope. This comes along with ultra-high reproducibility of measurement results and a low noise floor.

The new instrument is ideal for applications where the highest accuracy is required and essential to the manufacturing process. This is most beneficial for surfaces with steep slopes, with varying pitch directions, and small surfaces, such as moulds for smartphone lenses.

【Unparalleled measurement capability】

－HD = High Definition

Fast, reliable non-contact real 3D form measurement of aspheres

－Highest accuracy - up to 90° object slopes

Ideal for measuring strong, steep, and small aspheres incl. cell phone lens moulds

－Extremely good reproducibility of measurement results

Best shot-to-shot stability of Power and PV determination

－Very low system noise

Robust against environmental variations